IP Library Granted Patent US 7,875,957
Granted Patent B2
US 7,875,957 · App. 12/438,636 · Granted Jan 25, 2011

Semiconductor substrate for epitaxial growth and manufacturing method thereof

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Quick Facts
Patent No.
US 7,875,957
App. No.
12/438,636
Granted
Jan 25, 2011
Kind
B2
Abstract

Provided is a semiconductor substrate for epitaxial growth which does not require any etching treatment as a pretreatment in the stage of performing an epitaxial growth of HgCdTe film. A CdTe system compound semiconductor substrate for the epitaxial growth of the HgCdTe film is housed in an inactive gas atmosphere, in a predetermined period of time (for example, 10 hours) after mirror finish treatment thereof, to thereby regulate the proportion of Te oxide of the total amount of Te on the substrate surface which is obtained by XPS measurement so as to be not more than 30%.

Claims (2)

1. A CdTe system compound semiconductor substrate to perform an HgCdTe epitaxial growth, wherein the substrate is housed, sealed and stored in a predetermined wafer storage container within 10 hours after the substrate has been subjected to a mirror finish treatment, the predetermined wafer storage container being filled with an inactive gas, and wherein a proportion of a Te oxide of a total amount of Te on a surface of the substrate is not more than 30%, when the substrate is removed from the container and is used for the epitaxial growth, the proportion being able to be obtained by an XPS measurement carried out after the CdTe substrate has been stored for 30 days in the state of being stored.

2. A manufacturing method of a semiconductor substrate for an epitaxial growth to perform an HgCdTe epitaxial growth, comprising: housing, sealing and storing the substrate in a predetermined wafer storage container within 10 hours after the substrate has been subjected to a mirror finish treatment, the predetermined wafer storage container being filled with an inactive gas.

Assignments (5)
CHANGE OF ADDRESS OF ASSIGNEE Recorded Jun 2, 2017
From: JX NIPPON MINING & METALS CORPORATION
To: JX NIPPON MINING & METALS CORPORATION
Reel/Frame 042669/0315 →
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE ADDRESS PREVIOUSLY RECORDED AT REEL: 031781 FRAME: 0424. ASSIGNOR(S) HEREBY CONFIRMS THE CHANGE OF NAME. Recorded May 22, 2014
From: NIPPON MINING HOLDINGS, INC.
To: JX NIPPON MINING & METALS CORPORATION
Reel/Frame 033003/0896 →
CHANGE OF NAME Recorded Dec 13, 2013
From: NIPPON MINING HOLDINGS, INC
To: JX NIPPON MINING & METALS CORPORATION
Reel/Frame 031781/0424 →
MERGER Recorded Dec 11, 2013
From: NIPPON MINING & METALS CO. LTD
To: NIPPON MINING HOLDINGS, INC.
Reel/Frame 031757/0539 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 26, 2009
From: SUZUKI, KENJI; HIRANO, RYUICHI; KURITA, HIDEKI
To: NIPPON MINING & METALS CO., LTD.
Reel/Frame 022315/0211 →