A polishing pad capable of maintaining a high level of dimensional stability during absorption of moisture or water includes a polishing layer including a polyurethane foam having fine cells, wherein the polyurethane foam includes a cured product of a reaction of an isocyanate-terminated prepolymer (A), a polymerized diisocyanate, and a chain extender, and the isocyanate-terminated prepolymer (A) includes an isocyanate monomer, a high molecular weight polyol (a), and a low molecular weight polyol. A method for manufacturing such a polishing pad includes mixing a first component containing an isocyanate-terminated prepolymer with a second component containing a chain extender and curing the mixture to form a polyurethane foam. The pad so made is used in the manufacture of semiconductor devices.
1. A polishing pad, comprising a polishing layer comprising a polyurethane foam having fine cells,
the polyurethane foam comprising a cured product of a reaction of an isocyanate-terminated prepolymer (A), an isocyanate-terminated prepolymer (B), and a chain extender,
the isocyanate-terminated prepolymer (A) comprising isocyanate monomers, a high molecular weight polyol (a), and a low molecular weight polyol,
the isocyanate-terminated prepolymer (B) comprising a polymerized diisocyanate and a high molecular weight polyol (b),
wherein the high molecular weight polyol (a) is a polyether polyol with a number average molecular weight of 1000 to 2000, and the isocyanate monomers are toluene diisocyanate and dicyclohexylmethane diisocyanate,
the high molecular weight polyol (b) is a polyether polyol with a number average molecular weight of 250 to 650, and the polymerized diisocyanate is polymerized hexamethylene diisocyanate of isocyanurate type and/or biuret type, and
both the high molecular weight polyol (a) and the high molecular weight polyol (b) are polytetramethylene ether glycol.
2. The polishing pad according to claim 1 , wherein the polyurethane foam has an Asker D hardness of 45 to 65 degrees.
3. The polishing pad according to claim 1 , wherein the polyurethane foam contains 0.05 to 10% by weight of a nonionic silicone surfactant.
4. A method for manufacturing a semiconductor device, comprising the step of polishing a surface of a semiconductor wafer using the polishing pad according to claim 1 .
5. The polishing pad according to claim 1 , wherein the isocyanate-terminated prepolymer (B) is added in an amount of 5 to 60 parts by weight, based on 100 parts by weight of the isocyanate-terminated prepolymer (A).
6. The polishing pad according to claim 1 , wherein the polyurethane foam has an average cell diameter of 20 to 70 μm and shows a dimensional change of 0.8% or less and a water absorption rate of 4% or more when it absorbs water.