IP Library Granted Patent US 8,313,825
Granted Patent B2
US 8,313,825 · App. 12/440,488 · Granted Nov 20, 2012

Curable resin films

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Quick Facts
Patent No.
US 8,313,825
App. No.
12/440,488
Granted
Nov 20, 2012
Kind
B2
Abstract

A curable resin with at least one electrically conductive metal region on its surface formed by depositing on the surface a composition comprising activator, contacting the activator with a solution of a reducing agent and a solution of a metal ion, the reducing agent and metal ion undergoing chemical reaction activated by the activator to form an electrically conductive metal region on the surface, and method of forming is provided.

Claims (22)

1. A curable resin composition comprising:

an uncured resin film that comprises a viscous liquid reactive resin, said uncured resin film comprising a surface that is tacky;

separated solid regions that are located on the surface of said uncured resin film to form an electrically conductive pattern, said separated solid regions comprising a cured polymer matrix in which an activator and metal are included, said metal having been formed from a chemical reaction between ions of said metal and a reducing agent, said chemical reaction having been activated by said activator.

2. The curable resin composition according to claim 1 wherein the uncured resin film comprises a fibre reinforcement.

3. The curable resin composition according to claim 2 wherein the uncured resin film is in the form of a prepreg.

4. The curable resin composition according to claim 2 wherein said fibre reinforcement structure comprises fibres selected from the group consisting of carbon fibres, graphite fibres, glass fibres and aramid fibres.

5. The curable resin composition according to claim 2 wherein said viscous liquid reactive resin comprises an epoxy resin and a curing agent for said epoxy resin.

6. The curable resin composition according to claim 2 wherein said curable resin composition is shaped for use in forming an aeroplane body.

7. The curable resin composition according to claim 2 wherein said fibre reinforcement structure comprises a layer of non-conducting fibres and a layer of conducting fibres wherein said layer of non-conducting fibres is located between said layer of conducting fibres and the surface of said resin film.

8. The curable resin composition according to claim 7 wherein said layer of conducting fibres comprises carbon fibres.

9. The curable resin composition according to claim 1 wherein said metal is a transition group metal.

10. The curable resin composition according to claim 1 wherein said viscous liquid reactive resin is selected from the group consisting of epoxies, bismaleimides, cyanate esters, vinyl esters, unsaturated polyesters, benzoxazines and phenolics.

11. The curable resin composition according to claim 10 wherein said activator comprises palladium.

12. The curable resin composition according to claim 1 wherein said cured polymer matrix comprises polyester acrylate.

13. The curable resin composition according to claim 1 wherein said electrically conductive pattern is in the form of a plurality of parallel lines.

14. The curable resin composition according to claim 1 wherein said electrically conductive pattern is in the form of a grid of intersecting lines.

15. The curable resin composition according to claim 1 wherein said solid regions are in the form of a plurality of solid lines wherein said solid lines have a thickness in a direction perpendicular to the surface of said uncured film, wherein the thickness of said solid lines is less than 20 microns.

16. The curable resin composition according to claim 1 wherein said metal is selected from the group consisting of copper, nickel, silver, gold, cobalt, platinum and alloys thereof.

17. The curable resin composition according to claim 1 wherein said viscous liquid reactive resin comprises an epoxy resin and a curing agent for said epoxy resin.

18. The curable resin composition according to claim 1 wherein said viscous liquid reactive resin comprises particulate thermoplastics.

19. The curable resin composition according to claim 18 wherein said viscous liquid reactive resin comprises soluble or partially soluble thermoplastics.

20. The curable resin composition according to claim 1 wherein said viscous liquid reactive resin comprises soluble or partially soluble thermoplastics.

Assignments (1)
RELEASE OF SECURITY INTEREST Recorded Sep 3, 2013
From: BANK OF AMERICA, N.A.
To: HEXCEL CORPORATION
Reel/Frame 031140/0729 →