IP Library Granted Patent US 8,124,690
Granted Patent B2
US 8,124,690 · App. 12/441,270 · Granted Feb 28, 2012

Moisture curable polymer having SiF group, and curable composition containing the same

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Quick Facts
Patent No.
US 8,124,690
App. No.
12/441,270
Granted
Feb 28, 2012
Kind
B2
Abstract

A moisture curable polymer and a curable composition having superior curability are provided. A polymer having a silicon group represented by the general formula: —SiF a R 1 b Z c (wherein, R 1 represents any one of a substituted or unsubstituted hydrocarbon group having 1 to 20 carbon atoms, or an organosiloxy group represented by R 2 3 SiO— (R 2 is each independently, a substituted or unsubstituted hydrocarbon group having 1 to 20 carbon atoms). Z is a hydroxyl group or a hydrolyzable group other than fluorine. a is any one of 1, 2, or 3; b is any one of 0, 1, or 2; c is any one of 0, 1, or 2; and a+b+c is 3. When b or c is 2, two R 1 or two Z may be each the same or different) and a curable composition including this polymer, and a sealant and an adhesive in which the curable composition is used.

Claims (17)

1. A curable composition comprising:

(A) a polymer comprising a silicon group having a Si—F bond, wherein the main chain skeleton of the polymer (A) is at least one selected from the group consisting of a polyoxyalkylene based polymer, a saturated hydrocarbon based polymer, and a (meth)acrylic ester based polymer; and

(B) a polymer having one or more silicon groups on average per molecule which are represented by the following general formula (2):

—SiR 3 3-d Y d   (2)

(wherein, R 3 each independently represents a hydrocarbon group having 1 to 20 carbon atoms, or an organosiloxy group represented by R 4 3 SiO— (R 4 is each independently, a hydrocarbon group having 1 to 20 carbon atoms); further, Y is each independently, a hydroxyl group or a hydrolyzable group other than fluorine and d is any one of 1, 2, or 3), wherein said polymer (B) having one or more silicon groups has a number average molecular weight of 3,000 to 100,000.

2. The curable composition according to claim 1 wherein the polymer having one or more silicon groups on average per molecule which are represented by the above general formula (2) is an organic polymer having at least one main chain skeleton selected from the group consisting of a polyoxyalkylene based polymer, a saturated hydrocarbon based polymer, and a (meth)acrylic ester based polymer.

3. The curable composition according to claim 1 wherein Y in the above general formula (2) is an alkoxy group.

4. The curable composition according to claim 1 further comprising a curing catalyst.

5. The curable composition according to claim 4 wherein the curing catalyst is an amine compound.

6. The curable composition according to claim 1 wherein the polymer (A) comprising the silicon group having a Si—F bond has a number average molecular weight of 3,000 to 100,000.

7. The curable composition according to claim 1 wherein the silicon group having a Si—F bond is represented by the following general formula (1):

—SiF a R 1 b Z c   (1)

(wherein, R 1 represents any one of a substituted or unsubstituted hydrocarbon group having 1 to 20 carbon atoms, or an organosiloxy group represented by R 2 3 SiO— (R 2 is independently, a substituted or unsubstituted hydrocarbon group having 1 to 20 carbon atoms); Z is a hydroxyl group or a hydrolysable group other than fluorine; a is any one of 1, 2, or 3; b is any one of 0, 1, or 2; c is any one of 0, 1, or 2; and a+b+c is 3; and when b or c is 2, two R 1 or two Z may be each the same or different).

8. The curable composition according to claim 7 wherein the silicon group having a Si—F bond represented by the above general formula (1) is included in the number of one or more on average per molecule.

9. The curable composition according to claim 7 wherein Z in the above general formula (1) is an alkoxy group.

10. A sealant prepared using the curable composition according to claim 1 .

11. An adhesive prepared using the curable composition according to claim 1 .

Assignments (2)
CHANGE OF ADDRESS Recorded Jan 15, 2014
From: KANEKA CORPORATION
To: KANEKA CORPORATION
Reel/Frame 032019/0901 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 28, 2009
From: WAKABAYASHI, KATSUYU; SASAKI, TAISUKE
To: KANEKA CORPORATION
Reel/Frame 022602/0965 →