Distortion tolerant processing

1. A method of manufacturing an integrated circuit (IC) for driving a flexible display, comprising:

depositing a pattern of first features in a first layer on a flexible substrate, wherein said first features comprise one or more of data lines, interconnects for thin film transistors, flexible connectors, test patterns, or alignment marks and wherein said first features comprise:

a first set of first features regularly repeating in only a first direction in the plane of the substrate; and

a second set of first features regularly repeating in only a second direction in the plane of the substrate, the second direction orthogonal to the first direction;

depositing a pattern of repetitive second features as an array in a second layer on said first layer, wherein said second features comprise one or more of source, drain, or gate electrodes for thin film transistors and wherein said depositing comprises depositing a material and patterning said material using a step and repeat mask-based deposition process comprising:

depositing and patterning a first set of the second features in a first area of the second layer;

translating said substrate from a first position at which said first set of the second features is depositable to a second position at which a second set of the second features is depositable in a second area of the second layer;

depositing and patterning said second set of the second features in said second area; and

repeating said step and repeat deposition process to deposit said second features;

aligning said second layer and said first layer so as to allow electrical coupling between said first features and said second features,

wherein the mask is configured such that the first area is smaller than the entire array and the second area is smaller than the entire array wherein each of said first and said second areas are locally aligned to apply local distortion compensation during the deposition of said pattern of repetitive second features to enable said alignment.

2. A method according to claim 1 , wherein a distance between said first position and said second position is selected to correct for distortions in said flexible substrate.

3. A method according to claim 1 , wherein said material is deposited and patterned substantially at the same time by printing said material in a pattern onto said layer.

4. A method according to claim 1 , wherein patterning said material comprises selectively exposing said material to a light source to define said pattern in said material.

5. A method according to claim 4 , wherein said light source is a laser, and wherein said material is laser ablated.

6. A method according to claim 1 , wherein at least one of said first set of first features and said second set of first features is deposited along an edge portion of said first layer.

7. A method according to claim 1 , wherein said repetitive second features on said second layer are electrically coupled to said first features on said first layer by via connectors between said second and first layers.

8. A method according to claim 1 , wherein said first features are deposited on the lowest layer of said substrate.

9. A method according to claim 1 , wherein said first layer further comprises repetitive third features, and wherein said repetitive third features are electrically coupled to said first features.

10. A method according to claim 1 , wherein one or both of said second features and said first features comprises an organic solution-processed polymer semiconductor.

11. A method according to claim 1 , wherein said flexible substrate comprises polyethyleneterephtalate (PET) or polyethylenenaphtalene (PEN).

12. A method according to claim 1 , wherein said integrated circuit is an active matrix driver for driving a flexible display.

13. A method of compensating for distortion in a flexible substrate during manufacture of an integrated circuit (IC) for a flexible display, comprising:

depositing a pattern of first features on a flexible substrate to form a lower layer, wherein said first features comprise one or more of data lines, interconnects for thin film transistors, flexible connectors, test patterns, or alignment marks and wherein said first features comprise:

a first set of first features regularly repeating in only a first direction in the plane of the substrate; and

a second set of first features regularly repeating in only a second direction in the plane of the substrate, the second direction orthogonal to the first direction; and

depositing a pattern of repetitive second features as an array on the flexible substrate, wherein said second features comprise one or more of source, drain, or gate electrodes for thin film transistors and wherein said depositing comprises depositing a material and patterning said material using a step and repeat mask-based deposition process comprising:

depositing and patterning a first set of the second features in a first area of an upper layer;

translating said substrate from a first position at which said first set of the second features is depositable to a second position at which a second set of the second features is depositable in a second area of the upper layer;

depositing and patterning said second set of the second features in said second area; and

repeating said step and repeat deposition process to deposit said second features;

wherein the mask is configured such that the first area is smaller than the entire array and the second area is smaller than the entire array;

wherein local distortion compensation is applied during the deposition of said pattern of repetitive second features so as to allow said upper layer and said lower layer to be aligned with one another.

14. A method according to claim 13 , wherein said upper and lower layers are aligned with one another so as to allow electrical coupling between said first features and said second features.

15. A method according to claim 13 , wherein a distance between said first position and said second position is selected to correct for distortions in said flexible substrate.

16. A method of compensating for distortion in a flexible substrate during manufacture of an integrated circuit (IC) for a flexible display, comprising:

depositing a pattern of first features along an edge portion of a flexible substrate to form a lower layer, the first features comprising one or more of data lines, interconnects for thin film transistors, flexible connectors, test patterns, or alignment marks, and comprising a first set of first features regularly repeating in only a first direction and a second set of first features regularly repeating in only a second direction that is orthogonal to the first direction; and

depositing a material and patterning said material using a mask to define a pattern of second features as an array on the flexible substrate, wherein said second features comprise one or more of source, drain, or gate electrodes for thin film transistors, and wherein said depositing comprises:

depositing a first set of the second features in a first area of an upper layer;

translating said substrate from a first position at which said first set of the second features is depositable to a second position at which a second set of the second features is depositable in a second area of the second layer;

depositing said second set of the second features in said second area of the upper layer; and

repeating said step and repeat deposition process to deposit said second features;

wherein the mask is configured such that the first area is smaller than the entire array and the second area is smaller than the entire array;

wherein each of said first and second areas are locally aligned to apply local distortion compensation during the deposition of said pattern of second features so as to allow said upper and lower layers to be aligned with one another.