IP Library Granted Patent US 8,172,619
Granted Patent B2
US 8,172,619 · App. 12/450,411 · Granted May 8, 2012

Smart card heat sink

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Quick Facts
Patent No.
US 8,172,619
App. No.
12/450,411
Granted
May 8, 2012
Kind
B2
Abstract

A heat sink for a smart card, the heat sink having a contact plate having a contact surface, a riser extending upward from the contact plate, and a hook extending upward from the contact plate and located opposite the riser is disclosed. A smart card socket having a frame having a slot for receiving a smart card, the slot being defined by at least one wall, and a smart card heat sink at least partially abutted to the at least one wall is also disclosed. Finally, a method of transferring heat energy away from a smart card, comprising the steps of associating a smart card heat sink with a smart card socket and positioning at least a portion of the smart card heat sink between at least a portion of a smart card and at least a portion of the smart card socket is disclosed.

Claims (12)

1. A smart card socket, comprising:

a frame having a slot for receiving a smart card, the slot being defined by at least a left side wall and a right side wall and a crossbar that extends between the left side wall and the right side wall;

a smart card heat sink having a contact plate, at least a portion of the contact plate abuts the crossbar such that the portion of the contact plate is positioned between the crossbar and the slot.

2. The smart card socket according to claim 1 , wherein a contact surface of the contact plate is thermally connected to a thermally conductive face of a smart card in the slot.

3. The smart card socket according to claim 1 , the heat sink comprising:

a riser extending upward from the contact plate; and

a hook extending upward from the contact plate and located opposite the riser.

4. The smart card socket according to claim 3 , wherein the heat sink has a substantially J-shaped cross-sectional shape.

5. The smart card socket according to claim 3 , wherein the riser extends upward from the contact plate a greater distance than the hook extends upward from the contact plate.

6. The smart card socket according to claim 3 , wherein the contact plate is configured for contacting a thermally conductive face of the smart card.

7. The smart card socket according to claim 3 , wherein the riser prevents a movement of the heat sink with respect to the smart card socket by interfering with a portion of the smart card socket.

8. The smart card socket according to claim 3 , wherein the hook prevents a movement of the heat sink with respect to the smart card socket by interfering with a portion of the smart card socket.

Assignments (2)
CORRECTIVE ASSIGNMENT TO CORRECT THE RECEIVING PARTY NAME FROM INTERDIGITAL CE PATENT HOLDINGS TO INTERDIGITAL CE PATENT HOLDINGS, SAS. PREVIOUSLY RECORDED AT REEL: 47332 FRAME: 511. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Feb 28, 2024
From: THOMSON LICENSING
To: INTERDIGITAL CE PATENT HOLDINGS, SAS
Reel/Frame 066703/0509 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 26, 2018
From: THOMSON LICENSING
To: INTERDIGITAL CE PATENT HOLDINGS
Reel/Frame 047332/0511 →