Mother thin film transistor array substrate and thin film transistor array substrate fabricated therefrom
View Patent ↗A mother thin film transistor (TFT) array substrate includes an insulating substrate, at least two TFT arrays and printed wirings. The TFT array includes TFTs formed on the insulating substrate. The printed wirings are connected to the TFT arrays. The printed wiring includes a discontinuous metal layer and at least one bridge layer connecting the discontinuous metal layer. The bridge layer is made from corrosion-resistant material.
1. A mother thin film transistor (TFT) array substrate, comprising:
an insulating substrate;
at least two TFT arrays comprising a plurality of TFTs formed on the insulating substrate; and
a plurality of printed wirings connected to the TFT arrays, wherein at least one of the plurality of printed wirings comprises a discontinuous metal layer and at least one bridge layer connecting the discontinuous metal layer, the bridge layer being made from corrosion-resistant material,
wherein the discontinuous metal layer comprises a first metal layer partly covered by the bridge layer, a second metal layer partly covering the bridge layer, and a first disconnected portion between the first metal layer and the second metal layer and partly filled with the bridge layer.
2. The mother TFT array substrate of claim 1 , wherein the bridge layer is filled in the disconnected portion to electrically connect the discontinuous metal layer.
3. The mother TFT array substrate of claim 1 , wherein the discontinuous metal layer further comprises a third metal layer adjacent to the second metal layer and partly covered by the bridge layer, a second disconnected portion between the second layer and the third metal layer and partly filled with the bridge layer, and the second metal layer is located between the first metal layer and the third metal layer.
4. The mother TFT array substrate of claim 3 , wherein the first metal layer and the third metal layer are connected to the TFT arrays.
5. The mother TFT array substrate of claim 1 , wherein the mother TFT array substrate further comprises a protective layer covering the printed wirings.
6. The mother TFT array substrate of claim 1 , wherein the TFT array further comprises a plurality of pixel electrodes formed during the same photolithographic mask process as the bridge layer.
7. The mother TFT array substrate of claim 1 , wherein the bridge layer is made from indium tin oxide, indium zinc oxide, high-melting point metal, or alloy.
8. A thin film transistor (TFT) array substrate, comprising:
an insulating substrate;
a TFT array comprising a plurality of TFTs formed on the insulating substrate; and
a plurality of printed wirings connected to the TFTs, wherein at least one of the plurality of printed wirings comprises a discontinuous metal layer and at least one bridge layer connecting the discontinuous metal layer, the bridge layer being made from corrosion-resistant material,
wherein the discontinuous metal layer comprises a first metal layer partly covered by the bridge layer, a second metal layer partly covering the bridge layer, and a first disconnected portion between the first metal layer and the second metal layer and partly filled with the bridge layer.
9. The TFT array substrate of claim 8 , wherein the bridge layer is filled in the disconnected portion to electrically connect the discontinuous metal layer.
10. The TFT array substrate of claim 8 , wherein the discontinuous metal layer is made from aluminum or molybdenum.
11. The TFT array substrate of claim 8 , wherein the TFT array further comprises a plurality of pixel electrodes formed during the same photolithographic mask process as the bridge layer.
12. The TFT array substrate of claim 8 , wherein the bridge layer is made from indium tin oxide, indium zinc oxide, high-melting point metal, or alloy.
13. A thin film transistor (TFT) array substrate, comprising:
a substrate;
a plurality of TFTs formed on the substrate; and
a plurality of printed wirings connected to the TFTs, wherein at least one of the plurality of printed wirings comprises a discontinuous metal layer and a corrosion-resistant material layer connects to the discontinuous metal layer, wherein the discontinuous metal layer comprises a first metal layer partly covered by the bridge layer, a second metal layer partly covering the bridge layer, and a first disconnected portion between the first metal layer and the second metal layer and partly filled with corrosion-resistant material layer.