IP Library Granted Patent US 8,178,944
Granted Patent B2
US 8,178,944 · App. 12/456,833 · Granted May 15, 2012

Method for forming a one-time programmable metal fuse and related structure

Assignee: Broadcom Corporation
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Quick Facts
Patent No.
US 8,178,944
App. No.
12/456,833
Granted
May 15, 2012
Kind
B2
Abstract

According to one exemplary embodiment, a method for forming a one-time programmable metal fuse structure includes forming a metal fuse structure over a substrate, the metal fuse structure including a gate metal segment situated between a dielectric segment and a polysilicon segment, a gate metal fuse being formed in a portion of the gate metal segment. The method further includes doping the polysilicon segment so as to form first and second doped polysilicon portions separated by an undoped polysilicon portion where, in one embodiment, the gate metal fuse is substantially co-extensive with the undoped polysilicon portion. The method can further include forming a first silicide segment on the first doped polysilicon portion and a second silicide segment on the second doped polysilicon portion, where the first and second silicide segments form respective terminals of the one-time programmable metal fuse structure.

Claims (27)

1. A one-time programmable metal fuse structure comprising:

a gate metal fuse situated in a portion of a gate metal segment over a substrate;

a polysilicon segment situated over said gate metal fuse, said polysilicon segment comprising an undoped polysilicon portion situated between first and second doped polysilicon portions.

2. The one-time programmable metal fuse structure claim 1 , wherein said gate metal segment is situated between a dielectric segment and said polysilicon segment.

3. The one-time programmable metal fuse structure claim 1 , wherein said gate metal fuse is substantially co-extensive with said undoped polysilicon portion.

4. The one-time programmable metal fuse structure claim 2 , wherein said dielectric segment comprises a high-k dielectric material.

5. The one-time programmable metal fuse structure of claim 4 , wherein said high-k dielectric material is selected from the group consisting of hafnium oxide and zirconium oxide.

6. The one-time programmable metal fuse structure claim 1 further comprising a first silicide segment situated over said first doped polysilicon portion and a second silicide segment situated over said second doped polysilicon portion, wherein said first and second silicide segments form respective terminals of said one-time programmable metal fuse structure.

7. The one-time programmable metal fuse structure claim 1 , wherein said gate metal fuse has a thickness of between approximately 30.0 Angstroms and approximately 200.0 Angstroms.

8. The one-time programmable metal fuse structure claim 1 , wherein said gate metal fuse has a width of less than approximately 40.0 nanometers.

9. The one-time programmable metal fuse structure claim 1 , wherein said gate metal fuse comprises a metal selected from the group consisting of titanium nitride and tantalum nitride.

10. A one-time programmable metal fuse structure comprising:

a gate metal fuse situated in a portion of a gate metal segment over a substrate;

a polysilicon segment situated over said gate metal fuse, said polysilicon segment comprising an undoped polysilicon portion situated between first and second doped polysilicon portions;

a first silicide segment situated over said first doped polysilicon portion wherein said first silicide segment forms a terminal of said one-time programmable metal fuse structure.

11. The one-time programmable metal fuse structure of claim 10 further comprising a second silicide segment situated over said second doped polysilicon portion, wherein said first and second silicide segments form respective terminals of said one-time programmable metal fuse structure.

12. The one-time programmable metal fuse structure claim 10 , wherein said gate metal segment is situated between a dielectric segment and said polysilicon segment.

13. The one-time programmable metal fuse structure claim 10 , wherein said gate metal fuse is substantially co-extensive with said undoped polysilicon portion.

14. The one-time programmable metal fuse structure claim 12 , wherein said dielectric segment comprises a high-k dielectric material.

15. The one-time programmable metal fuse structure of claim 14 , wherein said high-k dielectric material is selected from the group consisting of hafnium oxide and zirconium oxide.

16. The one-time programmable metal fuse structure claim 10 , wherein said gate metal fuse comprises a metal selected from the group consisting of titanium nitride and tantalum nitride.

17. A one-time programmable metal fuse structure comprising:

a gate metal fuse situated in a portion of a gate metal segment over a substrate;

a polysilicon segment situated over said gate metal fuse, said polysilicon segment comprising an undoped polysilicon portion situated between first and second doped polysilicon portions, and wherein said gate metal segment is situated between a dielectric segment and said polysilicon segment;

a first silicide segment situated over said first doped polysilicon portion wherein said first silicide segment forms a terminal of said one-time programmable metal fuse structure.

18. The one-time programmable metal fuse structure claim 17 , wherein said dielectric segment comprises a high-k dielectric material.

19. The one-time programmable metal fuse structure of claim 18 , wherein said high-k dielectric material is selected from the group consisting of hafnium oxide and zirconium oxide.

Assignments (6)
CORRECTIVE ASSIGNMENT TO CORRECT THE EFFECTIVE DATE OF MERGER TO 09/05/2018 PREVIOUSLY RECORDED AT REEL: 047230 FRAME: 0133. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER. Recorded Oct 29, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047630/0456 →
MERGER Recorded Oct 4, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047230/0133 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS Recorded Feb 3, 2017
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: BROADCOM CORPORATION
Reel/Frame 041712/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 1, 2017
From: BROADCOM CORPORATION
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 041706/0001 →
PATENT SECURITY AGREEMENT Recorded Feb 11, 2016
From: BROADCOM CORPORATION
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 037806/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 22, 2009
From: XIA, WEI; CHEN, XIANGDONG; ITO, AKIRA
To: BROADCOM CORPORATION
Reel/Frame 022989/0235 →
Continuity (1)
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