ESD protection circuit and semiconductor device
View Patent ↗An electrostatic discharge protection circuit has a bipolar transistor which includes a first diffusion layer of a first conductive type connected with a first power supply and functioning as a base; a second diffusion layer of a second conductive type connected with a second power supply and functioning as a collector; and a third diffusion layer of the second conductive type connected with an input/output pad and functioning as an emitter. An area of a first region of the third diffusion layer which is opposite to the first diffusion layer is larger than an area of a second region of the second diffusion layer which is opposite to the first diffusion layer.
1. An electrostatic discharge protection circuit comprising a bipolar transistor which comprises:
a first diffusion layer of a first conductive type connected with a first power supply and functioning as a base;
a second diffusion layer of a second conductive type connected with a second power supply and functioning as a collector; and
a third diffusion layer of the second conductive type connected with an input/output pad and functioning as an emitter,
wherein an area of a first region of said third diffusion layer which horizontally aligns with said first diffusion layer, meaning an area of the first region of the diffusion layer having a top portion directly facing the first diffusion layer, is larger than an area of a second region of said second diffusion layer which horizontally aligns with said first diffusion layer, meaning an area of the second region of the second diffusion layer having a top portion directly facing the first diffusion layer.
2. The electrostatic discharge protection circuit according to claim 1 , wherein a current flowing from said first diffusion layer to said third diffusion layer flows through said first region.
3. The electrostatic discharge protection circuit according to claim 1 ,
wherein said second diffusion layer and said third diffusion layer are alternately arranged, and
at least a portion of said first diffusion layer is opposite to said first region and said second region.
4. The electrostatic discharge protection circuit according to claim 3 ,
wherein each of said second diffusion layer and said third diffusion layer comprises a rectangle with a short side and a long side,
said second diffusion layer and said third diffusion layer are arranged such that said long side of said second diffusion layer and said long side of said third diffusion layer are opposite to each other, and
said at least a portion of said first diffusion layer is arranged opposite to the short sides of said first region and said second region.
5. The electrostatic discharge protection circuit according to claim 3 , wherein each of said second diffusion layer and said third diffusion layer comprises a rectangle with a short side and a long side,
said second diffusion layer and said third diffusion layer are arranged such that said long side of said second diffusion layer and said long side of said third diffusion layer are opposite to each other, and
at least a portion of said first diffusion layer is opposite to the long side of said third diffusion layer.
6. The electrostatic discharge protection circuit according to claim 3 , wherein said first diffusion layer is arranged in a circumferential region to said second diffusion layer and said third diffusion layer.
7. The electrostatic discharge protection circuit according to claim 1 , wherein a width of said third diffusion layer is set based on a width of said first diffusion layer.
8. The electrostatic discharge protection circuit according to claim 1 , wherein a width of said third diffusion layer is set based on an amount of electrostatic discharge current to flow from said first diffusion layer.
9. The electrostatic discharge protection circuit according to claim 8 , wherein the amount of the electrostatic discharge current to flow from said first diffusion layer is determined in accordance with a size of a region of said first diffusion layer which is opposite to said third diffusion layer.
10. The electrostatic discharge protection circuit according to claim 1 , wherein said first diffusion layer comprises a continuous layer that surrounds said second diffusion layer and said third diffusion layer.
11. The electrostatic discharge protection circuit according to claim 1 , wherein said first diffusion layer comprises a layer which encloses said second diffusion layer and said third diffusion layer.
12. The electrostatic discharge protection circuit according to claim 11 , wherein said first diffusion layer comprises a rectangular shape.
13. A semiconductor device comprising:
an internal circuit connected with an input/output pad, and first and second power supplies; and
an electrostatic discharge protection circuit comprising a bipolar transistor, which comprises:
a first diffusion layer of a first conductive type connected with said first power supply and functioning as a base,
a second diffusion layer of a second conductive type connected with said second power supply and functioning as a collector, and
a third diffusion layer of the second conductive type connected with said input/output pad and functioning as an emitter,
wherein an area of a first region of said third diffusion layer which horizontally aligns with said first diffusion layer, meaning an area of the first region of the diffusion layer having a top portion directly facing the first diffusion layer, is larger than an area of a second region of said second diffusion layer which horizontally aligns with said first diffusion layer, meaning an area of the second region of the second diffusion layer having a top portion directly facing the first diffusion layer.
14. The semiconductor device according to claim 13 , wherein a current flowing from said first diffusion layer to said third diffusion layer flows through said first region.
15. The semiconductor device according to claim 13 , wherein said second diffusion layer and said third diffusion layer are alternately arranged, and
at least a portion of said first diffusion layer is opposite to said first region and said second region.
16. The semiconductor device according to claim 15 , wherein each of said second diffusion layer and said third diffusion layer comprises a rectangle with a short side and a long side,
said second diffusion layer and said third diffusion layer are arranged such that said long side of said second diffusion layer and said long side of said third diffusion layer are opposite to each other, and
said at least a portion of said first diffusion layer is arranged opposite to the short sides of said first region and said second region.
17. The semiconductor device according to claim 15 , wherein each of said second diffusion layer and said third diffusion layer comprises a rectangle with a short side and a long side,
said second diffusion layer and said third diffusion layer are arranged such that said long side of said second diffusion layer and said long side of said third diffusion layer are opposite to each other, and
at least a portion of said first diffusion layer is opposite to the long side of said third diffusion layer.
18. The semiconductor device according to claim 15 , wherein said first diffusion layer is arranged in a circumferential region to said second diffusion layer and said third diffusion layer.