Microwave plasma processing device

1. A microwave plasma processing device comprising:

fixing means for fixing a substrate as a processing target on a central axis in a plasma processing chamber;

exhausting means for depressurizing an inside and outside of the substrate from a mouth portion;

a metal processing gas supply member which is present in the substrate and forms a reentrant cylindrical resonating system along with the plasma processing chamber; and

microwave introducing means forming a predetermined node of an electric field intensity distribution with a node of a low electric field intensity distribution, the microwave introducing means being present at a side of the plasma processing chamber and at a height that the node of the low electric field intensity distribution is present, and introducing a microwave into the plasma processing chamber from the side of the plasma processing chamber against the node of the low electric field intensity distribution to perform processing,

wherein a microwave sealing member is provided at a substrate-holding portion of the fixing means and directly below the fixing means such that the microwave sealing member covers the exhausting means, and a connection position of the microwave introducing means is located at the predetermined node which shows the low electric field intensity formed along with the processing gas supply member by introducing the microwave,

a distance D between the microwave sealing member and a surface of the fixing means is 0 to 55 mm, and

a distance L between the microwave sealing member and an end portion of the processing gas supply member satisfies

when 0≦D≦20,

L=(nλ/2+λ/8)−3+α,

when 20≦D≦35,

L=(nλ/2+λ/8)−(0.060D 2 +4.2D−57)+α,

and

when 35≦D≦55,

L=(nλ/2+λ/8)−(0.030D 2 +2.1D−21)+α,

where n is an integer,

λ is a wavelength of the microwave, and

α is a fluctuation band in consideration of an influence and the like of the substrate on an electric field and is ±10 mm.

2. The microwave plasma processing device according to claim 1 , further comprising a microwave oscillator for oscillating the microwave, the microwave being introduced to the processing chamber through the microwave introducing means to thereby form the node of the electric field intensity distribution, said microwave introducing means being connected to the processing chamber at a position where the node is formed.

3. A microwave plasma processing device comprising:

fixing means for fixing a substrate as a processing target on a central axis in a plasma processing chamber;

exhausting means for depressurizing an inside and outside of the substrate;

a metal processing gas supply member which is present in the substrate and forms a reentrant cylindrical resonating system along with the plasma processing chamber; and

microwave introducing means forming a predetermined node of an electric field intensity distribution with a node of a low electric field intensity distribution, the microwave introducing means being present at a side of the plasma processing chamber and at a height that the node of the low electric field intensity distribution is present, and introducing a microwave into the plasma processing chamber from the side of the plasma processing chamber against the node of the low electric field intensity distribution to perform processing,

wherein a microwave sealing member different from the fixing means is formed on an end surface of a substrate-holding portion and directly below the fixing means such that the microwave sealing member covers the exhausting means, and a plasma ignition gap is formed between an end surface of the substrate and the microwave sealing member to generate plasma in the gap,

a distance D between the microwave sealing member and a surface of the fixing means is 0 to 55 mm, and

a distance L between the microwave sealing member and an end portion of the processing gas supply member satisfies

when 0≦D≦20,

L=(nλ/2+λ/8)−3+α,

when 20≦D≦35,

L=(nλ/2+λ/8)−(0.060D 2 +4.2D−57)+α,

and

when 35≦D≦55,

L=(nλ/2+λ/8)−(0.030D 2 +2.1D−21)+α,

where n is an integer,

λ is a wavelength of the microwave, and

α is a fluctuation band in consideration of an influence and the like of the substrate on an electric field and is ±10 mm.

4. The microwave plasma processing device according to claim 3 , wherein the microwave sealing member and the substrate-holding portion are formed relatively movable to the plasma processing device forming the microwave reentrant cylindrical resonating system, and the plasma ignition gap between the microwave sealing member and the end surface of the substrate-holding portion is adjusted by relatively moving the microwave sealing member and the substrate-holding portion.

5. The microwave plasma processing device according to claim 1 , wherein a distance H between the microwave searing member and the connection position of the microwave introducing means satisfies

H=L −( n 2 λ/2+λ/8−3)+β (mm),

where n 2 is an integer satisfying n 2 ≦n 1 −1,

λ is a wavelength of the microwave, and

β is a fluctuation band caused due to a dimension or the like of the substrate and is ±10 mm.

6. The microwave plasma processing device according to claim 3 , wherein a distance H between the microwave searing member and the connection position of the microwave introducing means satisfies

H=L −( n 2 λ/2+λ/8−3)+β (mm),

where n 2 is an integer satisfying n 2 ≦n 1 −1,

λ is a wavelength of the microwave, and

β is a fluctuation band caused due to a dimension or the like of the substrate and is ±10 mm.