Liquid crystal display and fabricating method thereof

1. A method of fabricating a liquid crystal display device having a matrix array of liquid crystal cells, comprising the steps of:

forming a plurality of drive lines to extend along a first direction on a substrate;

forming a plurality of pad lines to extend from the drive lines at a first angle from the first direction;

forming a plurality of pads to extend at the first angle and connected to the pad lines;

forming an insulating film material on the substrate to cover the pad lines and the pads;

forming a contact hole in the insulating film to expose one of the pads; and

forming an electrode pattern on the insulating film to connect to the pad through the contact hole,

wherein each of the plurality of pads extends at the same angle as the angle of the corresponding pad line and is connected to the corresponding pad line for supplying external drive signals,

wherein the pads and the pad lines are formed at relatively large angles in a case where the drive lines are located at an upper or lower part of a driving circuit, and

wherein the plurality of drive lines includes at least one of gate lines and data lines.

2. The method according to claim 1 , wherein the plurality of pads extending at the first angle are disposed along an edge of the substrate.

3. The method according to claim 2 , further includes a tape carrier package having a signal pad extending at the first angle and electrically contacting the plurality of pads.

4. The method according to claim 3 , further includes a driving circuit mounted on the tape carrier package for supplying external drive signals.

5. A method of fabricating a liquid crystal display device, comprising the steps of:

forming a plurality of drive lines to extend along first and second directions on a substrate;

forming a plurality of pad lines to extend from the plurality of drive lines at a first acute angle from an edge of the substrate;

forming a plurality of pads to extend at the first acute angle and connect to the plurality of pad lines;

forming an insulating film material on the substrate to cover the plurality of pad lines and the plurality of pads;

forming a plurality of contact holes in the insulating film to expose the plurality of pads; and

forming an electrode patterns on the insulating film to connect to the plurality of pads through the plurality of contact holes,

wherein the pads and the pad lines are formed at relatively large angles in a case where the drive lines are located at an upper or lower part of a driving circuit, and

wherein the plurality of drive lines includes gate lines and data lines.

6. The method according to claim 5 , further includes a tape carrier package having a signal pad extending at the first acute angle and electrically contacting the plurality of pads.

7. The method according to claim 6 , further includes a driving circuit mounted on the tape carrier package for supplying external drive signals.

8. The method according to claim 6 , wherein the signal pad directly overlaps the plurality of pads.