IP Library Granted Patent US 8,115,685
Granted Patent B2
US 8,115,685 · App. 12/458,070 · Granted Feb 14, 2012

Flat antenna structure

Assignee: Wistron Neweb Corp.
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Quick Facts
Patent No.
US 8,115,685
App. No.
12/458,070
Granted
Feb 14, 2012
Kind
B2
Abstract

The invention relates to a flat antenna structure. The flat antenna structure includes a first metal plate, an intermediate layer, a metal ring, and a second metal plate. The intermediate layer has a first hole, and the intermediate layer is installed above and connected to the first metal plate. The metal ring is connected to the first metal plate through the first hole. The second metal plate has a second hole. The second metal plate is connected to the metal ring and the first metal plate. The intermediate layer and the metal ring are wrapped by the first metal plate and the second metal plate. The second metal plate can be electrically connected to the first metal plate via the metal ring, and a resonator is formed between the first metal plate and the second metal plate. A characteristic of the flat antenna can be adjusted by changing the diameters of the first hole and the metal ring.

Claims (30)

1. A flat antenna structure comprising:

a first metal plate;

an intermediate layer having a first hole, the intermediate layer being installed above and connected to the first metal plate;

a metal ring connected to the first metal plate through the first hole; and

a second metal plate having a second hole, the second metal plate being connected to the metal ring and the first metal plate, the intermediate layer and the metal ring being sandwiched by the first metal plate and the second metal plate;

wherein the second metal plate is electrically connected to the first metal plate via the metal ring, and a resonator is formed between the first metal plate and the second metal plate, a characteristic of the flat antenna structure is adjusted by changing the diameters of the first hole and the metal ring.

2. The flat antenna structure as claimed in claim 1 , wherein the intermediate layer is a plastic plate.

3. The flat antenna structure as claimed in claim 1 , wherein the intermediate layer is made of high density polyethylene (HDPE).

4. The flat antenna structure as claimed in claim 1 , wherein the first metal plate is connected to the second metal plate by riveting.

5. The flat antenna structure as claimed in claim 1 , wherein the first metal plate is connected to the metal ring by screwing.

6. The flat antenna structure as claimed in claim 1 , wherein the intermediate layer is connected to the first metal plate and the second metal plate by adhesion.

7. The flat antenna structure as claimed in claim 1 , wherein the first metal plate and the second metal plate are made of copper or copper alloys.

8. The flat antenna structure as claimed in claim 1 , wherein the metal ring is made of copper or copper alloys.

9. The flat antenna structure as claimed in claim 1 , wherein the first metal plate and the second metal plate are made of silver or silver alloys.

10. The flat antenna structure as claimed in claim 1 , wherein the metal ring is made of silver or silver alloys.

11. An electronic device having a flat antenna structure, comprising:

a main body; and

a flat antenna structure electrically connected to the main body, the flat antenna structure comprising:

a first metal plate; an intermediate layer having a first hole, the intermediate layer being installed above and connected to the first metal plate; a metal ring connected to the first metal plate through the first hole; and

a second metal plate having a second hole, the second metal plate being connected to the metal ring and the first metal plate, the intermediate layer and the metal ring being sandwiched by the first metal plate and the second metal plate;

wherein the second metal plate is electrically connected to the first metal plate via the metal ring, and a resonator is formed between the first metal plate and the second metal plate, a characteristic of the flat antenna structure is adjusted by changing the diameters of the first hole and the metal ring.

12. The electronic device as claimed in claim 11 , wherein the first metal plate is connected to the second metal plate by riveting.

13. The electronic device as claimed in claim 11 , wherein the intermediate layer is a plastic plate.

14. The electronic device as claimed in claim 11 , wherein the intermediate layer is made of high density polyethylene (HDPE).

15. The electronic device as claimed in claim 11 , wherein the first metal plate is connected to the metal ring by screwing.

16. The electronic device as claimed in claim 11 , wherein the intermediate layer is connected to the first metal plate and the second metal plate by adhesion.

17. The electronic device as claimed in claim 11 , wherein the first metal plate and the second metal plate are made of copper or copper alloys.

18. The electronic device as claimed in claim 11 , wherein the metal ring is made of copper or copper alloys.

19. The electronic device as claimed in claim 11 , wherein the first metal plate and the second metal plate are made of silver or silver alloys.

20. The electronic device as claimed in claim 11 , wherein the metal ring is made of silver or silver alloys.

Assignments (2)
CHANGE OF NAME Recorded Jul 29, 2025
From: WISTRON NEWEB CORPORATION
To: WNC CORPORATION
Reel/Frame 072255/0226 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 30, 2009
From: CHEN, SHIH-HONG; CHANG, CHI-CHUNG
To: WISTRON NEWEB CORP.
Reel/Frame 022937/0506 →
Priority Claims (1)
TW 97127903 A · Jul 23, 2008 · national
Continuity (1)
Related Publication 20100019975A1 · Jan 28, 2010