Semiconductor device and method of manufacturing the same

1. A method of manufacturing a semiconductor device, comprising:

providing an insulating layer on a semiconductor substrate;

forming a groove portion in a dicing region of said insulating layer and forming a via hole in an internal circuit formation region of said insulating layer;

providing a first resist film on said insulating layer;

providing a second resist film to cover said first resist film;

selectively removing said second resist film, forming an interconnect opening according to an interconnect trench in a region covering an internal circuit formation region of said second resist film, and forming a position aligning opening in a region covering said dicing region of said second resist film;

detecting a positional relationship between said groove portion formed in said insulating layer and said position aligning opening of said second resist film so as to detect whether said interconnect opening of said second resist film exists at a predetermined position with respect to said via hole of said insulating layer; and

when it is detected that said interconnect opening of said second resist film exists at said predetermined position, selectively removing said first resist film and said insulating layer in accordance with said interconnect opening of said second resist film and said position aligning opening, and forming an interconnect trench according to said interconnect opening of said second resist film and an opening according to said position aligning opening of said second resist film in said insulating layer,

wherein, in said selectively removing of the second resist film, when said semiconductor substrate is seen in plan view from the side of a substrate surface, a region of said position aligning opening is formed to cover said groove portion.

2. The method according to claim 1 ,

wherein

in said detecting whether the interconnect opening of the second resist film exists at the predetermined position with respect to the via hole of the insulating layer, in the case where it is determined that said interconnect opening of said second resist film does not exist at said predetermined position with respect to said via hole of said insulating layer, the method further comprises:

detecting a deviation amount between said interconnect opening of said second resist film and said via hole of said insulating layer and removing said second resist film;

providing said second resist film again on said first resist film;

selectively removing a second resist film, forming an interconnect opening according to an interconnect trench in a region covering an internal circuit formation region of said second resist film, and forming a position aligning opening in a region covering said dicing region of said second resist film based on said deviation amount; and

detecting a positional relationship between said groove portion formed in said insulating layer and said position aligning opening of said second resist film, so as to detect whether said interconnect opening of said second resist film exists at a predetermined position with respect to said via hole of said insulating layer.

3. The method according to claim 1 ,

wherein

in said detecting whether the interconnect opening of the second resist film exists at the predetermined position with respect to the via hole of the insulating layer, applying light having a predetermined wavelength to said groove portion formed in said insulating layer and said position aligning opening of said second resist film while scanning said light along a surface of said semiconductor substrate, detecting a light reflected or diffracted by said groove portion and said position aligning opening, and detecting a positional relationship between a peak position of said light from said groove portion and a peak position of said light from said position aligning opening so as to detect whether said interconnect opening of said second resist film exists at said predetermined position with respect to said via hole of said insulating layer.

4. The method according to claim 3 ,

wherein

in said forming of the groove portion in the dicing region of the insulating layer and the forming of the via hole in the internal circuit formation region of the insulating layer, said groove portion where a width dimension along said light scanning direction is not less than 0.2 μm and not more than 5 □m is formed.

5. The method according to claim 3 ,

wherein

in said selectively removing of the second resist film, said position aligning opening where a width dimension along said light scanning direction is not less than 7 μm and not more than 20 μm is formed.

6. The method according to claim 3 ,

wherein

a distance between a sidewall crossing said scanning direction of said light among a sidewall constituting said position aligning opening formed in said second resist film and a sidewall of said groove portion adjacent to said sidewall constituting said position aligning opening and crossing said scanning direction of said light when said semiconductor substrate is seen in plan view from the side of the substrate surface is not less than 3 □m.

7. The method according to claim 3 ,

wherein

a wavelength of said light is not less than 400 nm and not more than 700 nm.

8. The method according to claim 3 ,

wherein

when said semiconductor substrate is seen in plan view from the side of the substrate surface, said region of said position aligning opening is formed in a rectangular frame shape, and

said groove portions are four slits that are covered by individual sides of the region of the position aligning opening.

9. The method according to claim 1 ,

wherein

said first resist film includes an ashing-resistant film.