Oxygen barrier compositions and related methods
View Patent ↗Oxygen barrier compositions for electrical devices and their related methods are provided. In certain embodiments, the oxygen barrier compositions comprise a meta-substituted aromatic resin and an additional aromatic epoxy resin. In some embodiments, the compositions have a chlorine content of less than approximately 1000 ppm. The compositions may have an oxygen permeability of less than approximately 0.4 cm 3 ·mm/m 2 ·atm·day at approximately 0% relative humidity and approximately 23° C. In certain embodiments, methods of curing the oxygen barrier compositions comprise partially curing the composition where, the partial cure is achieved through ultraviolet radiation or heat.
1. An oxygen barrier composition for an electrical component comprising:
a meta-substituted aromatic resin which is resorcinol diglycidyl ether;
an additional aromatic epoxy resin selected from the group consisting of: bisphenol-F diglycidyl ether, bisphenol-A diglycidyl ether, epoxidized phenol novolac resins, epoxidized cresol novolac resins, polycyclic epoxy resins, naphthalene diepoxides, and combinations thereof; and
an amine curing agent for effectuating a thermal latent cure, the amine curing agent comprising dicyandiamide;
wherein the composition is capable of undergoing a B-stageable cure achieved by a thermal latent cure,
wherein the composition has an oxygen permeability of less than approximately 0.4 cm 3 ·mm/m 2 ·atm·day at approximately 0% relative humidity and approximately 23° C., and
wherein the composition is substantially 100% solids.
2. The composition of claim 1 , wherein the additional aromatic epoxy resin is bisphenol-F diglycidyl ether.
3. The composition of claim 1 further comprising an accelerant capable of reducing the time or temperature of the thermal latent cure, wherein the accelerant is selected from the group consisting of: phenyl ureas, imidazoles, boron trichloride amine complexes, aliphatic bis ureas, meta-substituted phenols, resorcinol, phloroglucinol, and combinations thereof.
4. The composition of claim 3 , wherein the accelerant is a phenyl urea accelerant selected from the group consisting of: phenyl dimethyl urea, 4,4′ methylene bis (phenyl dimethyl urea), 2,4′ toluene bis (dimethyl urea), and combinations thereof.
5. The composition of claim 1 further comprising a filler selected from the group consisting of: platelet fillers, reinforcing fillers, alumina fillers, and silica fillers, boron nitride, and combinations thereof.
6. The composition of claim 1 , wherein the composition is a B-staged composition in a shape selected from the group consisting of a powder, pellet, tape, film, and pre-preg sheet.