Encapsulant module with opaque coating
The invention provides an encapsulant module for an image sensor device. The module includes an outer frame, a set of optical elements, and an opaque coating. The outer frame includes an enclosing wall and a first opening surrounded by the enclosing wall. The set of optical elements connects to and is disposed in the enclosing wall. The opaque coating overlies the enclosing wall.
1. An encapsulant module for an image sensor device, comprising:
an outer frame comprising an enclosing wall and a first opening open to an exterior of the encapsulant module surrounded by the enclosing wall;
a set of lenses directly connecting to the enclosing wall and configured with an aperture module;
an opaque coating overlying the enclosing wall and the aperture module, wherein the opaque coating comprises a coating opening aligned with an aperture opening of the aperture module such that the opaque coating shields parts of regions over the set of lenses; and
a flat transparent substrate, between the set of lenses and the first opening, wherein the footprint of the transparent substrate is substantially the same as that of the set of lenses.
2. The module as claimed in claim 1 , wherein
the outer frame further comprises a second opening opposing to the first opening and surrounded by the enclosing wall; and
the aperture module is disposed in the second opening, connecting to the enclosing wall.
3. The module as claimed in claim 1 , wherein the opaque coating leaves the set of lenses exposed by the aperture opening.
4. The module as claimed in claim 1 , wherein the footprint of the first opening is substantially the same as that of the transparent substrate.
5. The module as claimed in claim 1 , wherein the opaque coating conformally overlies the outer frame and the aperture module due to spraying, spin coating, dipping, tapping, or sputtering.
6. The module as claimed in claim 1 , wherein the opaque coating is an acrylic resin or epoxy resin overlying the outer frame and the aperture module.
7. The module as claimed in claim 1 , wherein the set of lenses is disposed in the enclosing wall.
8. The module as claimed in claim 1 , wherein the opaque coating extends to be adjacent to an edge of the aperture opening of the aperture module.
9. The module as claimed in claim 1 , wherein the aperture opening is unobstructed.
10. The module as claimed in claim 1 , wherein the transparent substrate is a rectangle.
11. The module as claimed in claim 1 , wherein the flat transparent substrate has a top surface and a bottom surface, and
wherein an entirety of the top surface is flat and an entirety of the bottom surface is flat.
12. The module as claimed in claim 1 , wherein the flat transparent substrate has a top surface and a bottom surface, and
wherein the top surface of the transparent substrate is a continuous flat surface along an entire length of the transparent substrate and the bottom surface of the transparent substrate is a continuous flat surface along an entire length of the transparent substrate.
13. The module as claimed in claim 1 , wherein the first opening extends through the enclosing wall.
14. An encapsulant module for an image sensor device, comprising:
an outer frame comprising an enclosing wall and a first opening open to an exterior of the encapsulant module surrounded by the enclosing wall;
a lens connected to the enclosing wall by a supporter, wherein the lens is configured with an aperture module;
an opaque coating overlying the enclosing wall and the aperture module, wherein the opaque coating comprises a coating opening aligned with an aperture opening of the aperture module such that the opaque coating shields parts of regions over the lens; and
a flat transparent substrate, between the lens and the first opening, wherein the footprint of the transparent substrate is substantially the same as that of the lens.
15. The module as claimed in claim 14 , wherein
the outer frame further comprises a second opening opposing to the first opening and surrounded by the enclosing wall; and
the aperture module is disposed in the second opening, connecting to the enclosing wall.
16. The module as claimed in claim 14 , wherein the opaque coating leaves the lens exposed by the aperture opening.
17. The module as claimed in claim 14 , wherein the footprint of the first opening is substantially the same as that of the transparent substrate.
18. The module as claimed in claim 14 , wherein the opaque coating conformally overlies the outer frame and the aperture module due to spraying, spin coating, dipping, tapping, or sputtering.
19. The module as claimed in claim 14 , wherein the opaque coating is an acrylic resin or epoxy resin overlying the outer frame and the aperture module.
20. The module as claimed in claim 14 , wherein the lens is disposed in the enclosing wall.
21. A method for manufacturing an image sensor device, comprising:
providing an outer frame comprising an enclosing wall and an aperture module;
providing a set of lenses directly connecting to the enclosing wall;
overlying an opaque coating over the outer frame and the aperture module;
providing a flat transparent substrate between the set of lenses and the aperture module; and
forming an opening of the opaque coating by etching the opaque coating,
wherein the opening of the opaque coating is aligned with an opening, open to an exterior encapsulant module surrounded by the enclosing wall of the aperture module.