IP Library Granted Patent US 8,440,292
Granted Patent B2
US 8,440,292 · App. 12/465,128 · Granted May 14, 2013

Multi-layer article for flexible printed circuits

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Quick Facts
Patent No.
US 8,440,292
App. No.
12/465,128
Granted
May 14, 2013
Kind
B2
Abstract

Provided is a multi-layer article comprising an electrically conductive metal layer adheringly contacting the surface of a polymeric composite film less than 500 μm in thickness, having a surface, the polymeric composite film comprising a polymer and a plurality of surface-modified hexagonal boron nitride particles dispersed therewithin. A process of film casting onto a conductive metal layer is provided.

Claims (11)

1. A multi-layer article comprising an electrically conductive metal layer adheringly contacting a surface of a polymeric composite film the polymeric composite film comprising a polymer and a plurality of surface-modified hexagonal boron nitride particles dispersed therewithin comprising hexagonal boron nitride particles having a surface and a substituted phenyl radical bonded to the surface, the substituted phenyl radical being represented by the structure:

wherein X is a radical selected from NH 2 —, HO—, R 2 OC(O)—, R 2 C(O)O—, HSO 3 —, NH 2 CO—, halogens, alkyl and substituted or unsubstituted aryl; wherein R 1 is hydrogen, alkyl or alkoxy, R 2 is hydrogen, alkyl, or substituted or unsubstituted aryl.

2. The multi-layer article of claim 1 wherein R 1 is hydrogen, and X is NH 2 —.

3. The multi-layer article of claim 1 wherein R 1 is hydrogen, and X is HO—.

4. The multi-layer article of claim 1 wherein the polymer is polyimide.

5. The multi-layer article of claim 1 wherein the polymer is a cured epoxy resin composition.

6. The multi-layer article of claim 1 wherein the surface-modified hexagonal boron nitride particles have a size within the range of 0.5 to 50 μm.

7. The multi-layer article of claim 6 wherein the surface-modified hexagonal boron nitride is present at a concentration of 30 to 70% by weight.

8. The multi-layer article of claim 1 wherein the electrically conductive metal layer is copper.

9. The multi-layer article of claim 1 wherein the electrically conductive metal layer is in the form of discrete conductive pathways.

10. The multi-layer article of claim 1 wherein, the polymeric composite film is less than 500 μm in thickness.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 25, 2019
From: E. I. DU PONT DE NEMOURS AND COMPANY
To: DUPONT POLYMERS, INC.
Reel/Frame 049587/0098 →