Thermal management system for card cages
View Patent ↗A system is provided herein which comprises (a) a plurality of circuit boards ( 207 ); (b) a plurality of slots ( 205 ), wherein each of said slots is adapted to provide power to a circuit board coupled thereto, and wherein each of said circuit boards is coupled to one of said slots; and (c) a thermal management card ( 209 ) disposed in one of said slots, said thermal management card containing at least one synthetic jet ejector.
1. A device, comprising:
a plurality of circuit boards;
a plurality of slots, wherein each of said slots is adapted to provide power to a circuit board coupled thereto, and wherein each of said circuit boards is coupled to one of said slots; and
a thermal management card disposed in one of said slots, said thermal management card containing at least one synthetic jet ejector.
2. The device of claim 1 , wherein said thermal management card is adapted to cool at least one of said circuit boards.
3. The device of claim 1 , wherein said plurality of circuit boards are disposed within a card cage.
4. The device of claim 1 , wherein said synthetic jet ejector is adapted to run off of the power supplied by the slot the thermal management card is inserted into.
5. The device of claim 1 , further comprising a plurality of thermal management cards, wherein each of said plurality of thermal management cards is disposed in one of said slots, and wherein each of said plurality of thermal management cards contains at least one synthetic jet ejector.
6. The device of claim 5 , wherein any two of said plurality of circuit boards has at least one thermal management card disposed between them.
7. The device of claim 6 , wherein each of said thermal management cards is adapted to direct a plurality of synthetic jets onto or across a surface of an adjacent circuit board.
8. The device of claim 7 , wherein each of said thermal management cards has first and second major surfaces, wherein said first major surface is equipped with a plurality of nozzles or apertures adapted to direct a first plurality of synthetic jets across or onto a major surface of a first circuit board disposed in a first slot adjacent to the slot occupied by the thermal management card, and wherein said second surface is equipped with a second plurality of nozzles or apertures adapted to direct a second plurality of synthetic jets across or onto a major surface of a second circuit board disposed in a second slot adjacent to the slot occupied by the thermal management card.
9. The device of claim 8 , wherein said first plurality of synthetic jets are created by a first synthetic jet actuator, and wherein said second plurality of synthetic jets are created by a second synthetic jet actuator.
10. The device of claim 9 , wherein the first and second synthetic jet actuators are disposed within the thermal management card.
11. The device of claim 8 , wherein said first and second plurality of synthetic jets are created by the same synthetic jet actuator.
12. The device of claim 11 , wherein the synthetic jet actuator is disposed within the thermal management card.
13. The device of claim 1 , wherein said thermal management card is thicker than any of said plurality of circuit boards, and wherein the thickness of each of the plurality of circuit boards and the thermal management card is measured along an axis which is perpendicular to a major surface of the card.
14. The device of claim 12 , wherein said thermal management card has a first major surface equipped with a plurality of nozzles or apertures adapted to direct a first plurality of synthetic jets across a major surface of a first circuit board disposed in a slot adjacent to the slot occupied by the thermal management card, and wherein the thickness of the thermal management card is selected such that the cooling effect provide by the first plurality of synthetic jets is essentially optimized.
15. The device of claim 13 , wherein said thermal management card has a second major surface equipped with a plurality of nozzles or apertures adapted to direct a second plurality of synthetic jets across a major surface of a second circuit board disposed in a slot adjacent to the slot occupied by the thermal management card, and wherein the thickness of the thermal management card is selected such that the cooling effect provide by the second plurality of synthetic jets is essentially optimized.
16. A device, comprising:
a plurality of circuit boards;
a plurality of slots, wherein each of said slots is adapted to provide power to a circuit board coupled thereto, and wherein each of said circuit boards is coupled to one of said slots;
a synthetic jet ejector; and
a hollow support element for supporting said plurality of circuit boards and said plurality of slots, said support element being equipped with a plurality of apertures which are in fluidic communication with said synthetic jet ejector, and which are adapted to direct a plurality of synthetic jets onto or across the surfaces of said plurality of circuit boards.
17. The device of claim 16 , wherein the interior of said support element is in fluidic communication with a synthetic jet actuator.
18. A device, comprising:
a circuit board having a first electrical connector adapted to mate with a socket, and having a second group of electrical connectors thereon; and
a first add-on module releasably attachable to at least one of said second group of electrical connectors, said first add-on module comprising a first synthetic jet actuator.
19. The device of claim 18 , wherein aid circuit board has a third group of electrical connectors thereon.
20. The device of claim 19 , further comprising a second add-on module releasably attachable to at least one of said third group of electrical connectors, said second add-on module comprising a second synthetic jet actuator.
21. The device of claim 20 , wherein said second and third group of electrical connectors are in electrical communication with said first electrical connector.
22. The device of claim 18 , wherein said first add-on module comprises a first plurality of nozzles which are in fluidic communication with said first synthetic jet actuator, and wherein said first plurality of nozzles is adapted to direct a plurality of synthetic jets across or onto at least one surface of said circuit board.
23. The device of claim 22 , further comprising a second add-on module releasably attachable to at least one of said third group of electrical connectors, said second add-on module comprising a second synthetic jet actuator;
wherein said second add-on module comprises a second plurality of nozzles which are in fluidic communication with said second synthetic jet actuator, and wherein said second plurality of nozzles is adapted to direct a plurality of synthetic jets across or onto at least one surface of said circuit board.
24. The device of claim 23 , wherein said second and third groups of connectors are disposed on opposing sides of said circuit board.
25. A device, comprising:
a circuit board having a first electrical connector;
a circuit board holder having a first socket adapted to mate with said first electrical connector, and having a second electrical connector adapted to mate with a second socket;
wherein said circuit board holder is equipped with a first synthetic jet actuator which is in fluidic communication with a first set of nozzles.
26. The device of claim 25 , wherein said circuit board holder is equipped with a second synthetic jet actuator which is in fluidic communication with a second set of nozzles.
27. The device of claim 26 , wherein said first and second sets of nozzles are adapted to direct first and second sets of synthetic jets across at least one surface of said circuit board when said first socket is mated with said first electrical connector.