Modular heatsink mounting system
View Patent ↗In one example, a host system includes a PCB, a plurality of rails disposed on the PCB, and a connector disposed on the PCB. The PCB, rails and connector define a slot configured to receive an optoelectronic module. The host system further includes means for removably mounting a modular heatsink to the host system such that the host system directly contacts the optoelectronic module when the optoelectronic module is fully inserted into the slot. The means for removably mounting has a standardized arrangement such that any modular heatsink having a mounting arrangement that is complementary to the standardized arranged can be removably mounted to the host system.
1. A host system comprising:
a printed circuit board;
a plurality of rails disposed on the printed circuit board;
a connector disposed on the printed circuit board, wherein the printed circuit board, the plurality of rails, and the connector define a slot configured to receive an optoelectronic module; and
means for removably mounting a modular heatsink to the host system such that the modular heatsink directly contacts the optoelectronic module when the optoelectronic module is fully inserted into the slot, the means for removably mounting having a standardized arrangement such that any modular heatsink having a mounting arrangement that is complementary to the standardized arrangement can be removably mounted to the host system, wherein the means for removably mounting comprise a plurality of posts disposed on the plurality of rails.
2. The host system of claim 1 , further comprising a modular heatsink removably mounted to the host system.
3. The host system of claim 2 , further comprising means for substantially preventing sliding contact between the optoelectronic module and the modular heatsink during insertion of the optoelectronic module into the slot.
4. The host system of claim 3 , wherein the means for substantially preventing sliding contact comprise one or more of: the plurality of rails, or a clamping mechanism.
5. The host system of claim 1 , wherein the means for removably mounting comprise a plurality of mounting points disposed on the plurality of rails.
6. The host system of claim 1 , wherein the means for removably mounting comprise a plurality of through holes formed in the plurality of rails.
7. The hose system of claim 1 , wherein a height above the printed circuit board along a substantial length of each of the plurality of rails is less than a height of the module above the printed circuit board.
8. A host system comprising:
a printed circuit board;
a plurality of rails disposed on the printed circuit board;
a connector disposed on the printed circuit board, wherein the printed circuit board, the plurality of rails, and the connector define a slot configured to receive an optoelectronic module;
one or more mounting points arranged on the host system in a standardized manner allowing for interchangeable use of any one of a plurality of different modular heatsinks, each of the modular heatsinks having a mounting arrangement that is complementary to the standardized arrangement of the one or more mounting points such that each of the modular heatsinks can be removably mounted to the host system;
means for bringing a mounted modular heatsink and the optoelectronic module into contact with each other in a direction substantially normal to corresponding contact surfaces of the mounted modular heatsink and the optoelectronic module, wherein the contact surface of the optoelectronic module includes an enhanced thermal interface disposed on the contact surface of the optoelectronic module, the enhanced thermal interface comprising one or more of: thermal grease, a thermal pad, thermal gel, thermal tape, or thermal paste.
9. The host system of claim 8 , wherein the means for bringing the mounted modular heatsink and the optoelectronic module into contact with each other comprises the plurality of rails.
10. The host system of claim 8 , wherein the means for bringing the mounted modular heatsink and the optoelectronic module into contact with each other comprises a clamping mechanism.
11. The host system of claim 8 , further comprising means for substantially preventing sliding contact between the optoelectronic module and the mounted modular heatsink during insertion of the optoelectronic module into the slot such that the enhanced thermal interface is not substantially damaged during insertion of the optoelectronic module into the slot.
12. The host system of claim 8 , wherein each of the plurality of rails is characterized by a first height above the printed circuit board and the optoelectronic module is characterized by a second height above the printed circuit board that is greater than the first height.
13. The host system of claim 8 , wherein each of the plurality of different modular heatsinks include characteristics that vary between the plurality of different modular heatsinks, the characteristics including one or more of width, length, height, or material.
14. A host system comprising:
a printed circuit board;
a plurality of rails disposed on the printed circuit board;
a connector disposed on the printed circuit board, wherein the printed circuit board, the plurality of rails, and the connector define a slot configured to receive an optoelectronic module; and
means for removably mounting a modular heatsink to the host system such that the modular heatsink directly contacts the optoelectronic module when the optoelectronic module is fully inserted into the slot, the means for removably mounting having a standardized arrangement such that any modular heatsink having a mounting arrangement that is complementary to the standardized arrangement can be removably mounted to the host system, wherein a height above the printed circuit board along a substantial length of each of the plurality of rails is less than a height of the module above the printed circuit board.