IP Library Granted Patent US 8,017,691
Granted Patent B2
US 8,017,691 · App. 12/466,425 · Granted Sep 13, 2011

Polyarylene ether ketone moulding composition having good notched impact resistance

Assignee: Evonik Degussa GmbH
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Quick Facts
Patent No.
US 8,017,691
App. No.
12/466,425
Granted
Sep 13, 2011
Kind
B2
Abstract

A molding composition with high notched impact resistance contains the following components: a) from 75 to 99.9 parts by weight of polyarylene ether ketone, and b) from 0.1 to 25 parts by weight of polyalkenylene having from 5 to 12 carbon atoms in the repeat unit, the total of these parts by weight being 100.

Claims (33)

1. A moulding composition, comprising:

a) from 75 to 99.9 parts by weight of polyarylene ether ketone; and

b) from 0.1 to 25 parts by weight of polyalkenylene having from 5 to 12 carbon atoms in a repeat unit,

wherein a total sum of the parts by weight of a) and b) is 100.

2. The moulding composition according to claim 1 , wherein a sum of components a) and b) is at least 30% by weight, based on the weight of the moulding composition.

3. The moulding composition according to claim 1 , wherein the polyarylene ether ketone is a polyether ether ketone (PEEK), a polyyether ketone (PEK), a polyether ketone ketone (PEKK), a polyether ether ketone ketone (PEEKK) or mixtures thereof.

4. A moulding, obtained from the moulding composition according to claim 1 .

5. The moulding according to claim 4 , which consists of the moulding composition according to claim 1 .

6. The moulding according to claim 4 , which is a composite part.

7. The moulding composition according to claim 1 , comprising from 80 to 99 parts by weight of a), and from 1 to 20 parts by weight of b).

8. The moulding composition according to claim 1 , comprising from 85 to 98 parts by weight of a), and from 2 to 15 parts by weight of b).

9. The moulding composition according to claim 1 , comprising from 30 to 100% by weight of components a) and b) based on the weight of the moulding composition.

10. The moulding composition according to claim 1 , comprising from 40 to 98% by weight of components a) and b) based on the weight of the moulding composition.

11. The moulding composition according to claim 1 , comprising from 50 to 95% by weight of components a) and b) based on the weight of the moulding composition.

12. The moulding composition according to claim 1 , wherein said polyarylene ether ketone comprises at least one unit of the following formulae

(—Ar—X—) and/or

(—Ar′—Y—),

wherein Ar and Ar′ independently are a divalent aromatic radical, X is an electron-withdrawing group, and Y is a group different from X.

13. The moulding composition according to claim 1 , wherein said polyarylene ether ketone comprises at least one unit of the following formulae

(—Ar—X—) and/or

(—Ar′—Y—),

wherein Ar and Ar′ independently are 1,4-phenylene, 4,4′-biphenylene, 1,4-naphthylene, 1,5-naphthylene or 2,6-naphthylene,

X is carbonyl or sulphonyl, and

Y is O, S, CH 2 , or isopropylidene.

14. The moulding composition according to claim 12 , wherein at least 50% of the groups X are a carbonyl group, and at least 50% of the groups Y are oxygen.

15. The moulding composition according to claim 12 , wherein 100% of the groups X are carbonyl groups, and 100% of the groups Y are oxygen.

16. The moulding composition according to claim 1 , wherein the polyalkenylene comprises a repeat unit of the following formula

CH═CH—(CH 2 ) n

wherein n=from 3 to 10.

17. The moulding composition according to claim 1 , wherein a degree of polymerization of the polyalkenylene is from 6 to 2000.

18. The moulding composition according to claim 12 , wherein the polyalkenylene is polypentenylene, polyhexenylene, polyheptenylene, polyoctenylene, polynonenylene, polydecenylene, poly(3-methyloctenylene), poly(3-methyldecenylene), polyundecenylene, polydodecenylene or mixtures thereof.

19. The moulding composition according to claim 1 , wherein the polyalkenylene is a polyalkenamer selected from the group consisting: of polypentenamer, polyhexenamer, polyheptenamer, polyoctenamer and mixtures thereof.

20. The moulding composition according to claim 1 , further comprising a fluoropolymer, polysulphone, polyether sulphone, polyphenylene sulphone, polybenzimidazole, polyphenylene sulphide, semiaromatic polyamide, liquid-crystalline polymer, polyimide, polyetherimide or mixtures thereof.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 8, 2011
From: RICHTER, ALEXANDER; LOHKAEMPER, HANS-GUENTER
To: EVONIK DEGUSSA GMBH
Reel/Frame 026712/0653 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 8, 2011
From: RICHTER, ALEXANDER; LOHKAEMPER, HANS-GUENTER
To: EVONIK DEGUSSA GMBH
Reel/Frame 026712/0830 →
Continuity (1)
Related Publication 20090292073A1 · Nov 26, 2009