Method of manufacturing an electrically driven LED lamp assembly
View Patent ↗A method of manufacturing an electrically driven L.E.D. lamp assembly ( 20 ) comprises disposing an electrically insulative coating ( 24 ) on a thermally conductive substrate ( 22 ). A plurality of light emitting diodes ( 26 ) is secured to the coating ( 24 ). A coupling agent is disposed on a tape portion ( 48 ) of a foil tape ( 46 ), and the foil tape ( 46 ) is secured to the coating ( 24 ) with the coupling agent in predetermined spaced lengths ( 42 ) along the coating ( 24 ) to establish discrete and electrically conductive spaced lengths ( 42 ) with the light emitting diodes ( 26 ) disposed between the spaced lengths ( 42 ). Each light emitting diode ( 26 ) includes a pair of electrical leads ( 32 ) which are secured to the spaced lengths ( 42 ) to electrically interconnect the light emitting diodes ( 26 ).
1. A method of manufacturing an electrically driven L.E.D. lamp assembly ( 20 ) comprising the steps of;
disposing an electrically insulative coating ( 24 ) having a low thermal resistance on an electrically conductive and thermally conductive substrate ( 22 ),
securing a plurality of light emitting diodes ( 26 ) to the coating ( 24 ) with each light emitting diode ( 26 ) having a pair of LED electrical leads ( 32 ),
disposing a coupling agent on a tape portion ( 48 ) of a foil tape ( 46 ) to establish a coupling portion ( 50 ) of the foil tape ( 46 ) for securing the foil tape ( 46 ) to the coating ( 24 ),
securing the foil tape ( 46 ) to the coating ( 24 ) with the coupling agent in predetermined spaced lengths ( 42 ) along the coating ( 24 ) to establish discrete and electrically conductive spaced lengths ( 42 ) of the foil tape ( 46 ) for preventing electrical conduction between the spaced lengths ( 42 ) and from the spaced lengths ( 42 ) to the light emitting diodes ( 26 ),
securing the LED electrical leads ( 32 ) to the spaced lengths ( 42 ) of the foil tape ( 46 ) to electrically interconnect the light emitting diodes ( 26 ),
adhesively securing a plurality of ballast resistors ( 36 ) to the coating ( 24 ) with a thermally conductive adhesive with each ballast resistor ( 36 ) having a pair of resistor electrical leads ( 38 ), and wherein
said disposing the electrically insulative coating ( 24 ) step is further defined as disposing the electrically insulative coating ( 24 ) having a coating thickness (T 2 ) in the range of 20 to 100 micrometers on the thermally conductive substrate ( 22 ) formed of aluminum and having a substrate thickness (T 1 ) in the range of 1 to 2 millimeters to electrically isolate the substrate ( 22 ),
said securing the plurality of light emitting diodes ( 26 ) step is further defined as adhesively securing a plurality of LED heat sinks ( 30 ) of the plurality of light emitting diodes ( 26 ) to the coating ( 24 ) by disposing a thermally conductive adhesive between the coating ( 24 ) and the LED heat sink ( 30 ) with each heat sink ( 32 ) of each light emitting diode ( 26 ) having a LED body ( 28 ) disposed thereon,
said disposing the coupling agent ( 34 ) on the tape portion ( 48 ) to establish the coupling portion ( 50 ) step is further defined as plating the tape portion ( 48 ) formed of an electrically conductive metal having a variable foil width (W) and a foil thickness (T 3 ) in the range of 20 to 100 micrometers and disposing a pressure sensitive adhesive axially along the tape portion ( 48 ) of the foil tape ( 46 ) to establish the coupling portion ( 50 ) for adhering the foil tape ( 46 ) to the coating ( 24 ),
said securing the foil tape ( 46 ) to the coating ( 24 ) step is further defined as adhesively securing the foil tape ( 46 ) to the coating ( 24 ) with the coupling agent ( 34 ) for preventing electrical conduction between the spaced lengths ( 42 ) and from the spaced lengths ( 42 ) to the LED heat sinks ( 30 ) and the ballast resistors ( 36 ), and
said securing the LED electrical leads ( 32 ) to the spaced lengths ( 42 ) step is further defined as adhesively securing the LED electrical leads ( 32 ) to the spaced lengths ( 42 ) of the foil tape ( 46 ) and the resistor electrical leads ( 38 ) to the spaced lengths ( 42 ) of the foil tape ( 46 ) with an electrically conductive adhesive to electrically interconnect the light emitting diodes ( 26 ) and the ballast resistors ( 36 ).
2. A method as set forth in claim 1 wherein said adhesively securing the LED electrical leads ( 32 ) to the spaced lengths ( 42 ) of the foil tape ( 46 ) and the resistor electrical leads ( 38 ) to the spaced lengths ( 42 ) of the foil tape ( 46 ) step is further defined as soldering the LED electrical leads ( 32 ) to the spaced lengths ( 42 ) of the foil tape ( 46 ) and the resistor electrical leads ( 38 ) to the spaced lengths ( 42 ) of the foil tape ( 46 ) to electrically interconnect the light emitting diodes ( 26 ) and the ballast resistors ( 36 ).
3. A method as set forth in claim 1 including the steps of;
cutting a sheet of metal foil to define a circuit ( 40 ) of the foil tape ( 46 ), and
transferring the circuit ( 40 ) of foil tape ( 46 ) to the coating ( 24 ) by placing the circuit ( 40 ) on a transfer sheet for disposing the circuit ( 40 ) on the coating ( 24 ).