High dielectric constant laser direct structuring materials
View Patent ↗High dielectric constant thermoplastic compositions that are capable of being used in a laser direct structuring process. The compositions include a thermoplastic base resin, a laser direct structuring additive, and at least one ceramic filler. The compositions provide a high dielectric constant, low loss tangent thermoplastic composition. The compositions can be used in a variety of applications such as personal computers, notebook and portable computers, cell phone antennas and other such communications equipment, medical applications, RFID applications, and automotive applications.
1. A thermoplastic composition, comprising:
a) from 10 to 90% by weight of a thermoplastic base resin;
b) from 0.1 to 30% by weight of a laser direct structuring additive; and
c) 10 to 80% or less by weight of at least one ceramic filler, wherein the at least one ceramic filler has a dielectric constant of 25 or greater when measured at 900 MHz or greater and is selected from metal oxides, silicates, borides, carbides, nitrides, perovskites, perovskite derivatives, or a combination including at least one of the foregoing ceramic fillers having a dielectric constant of 25 or greater when measured at 900 MHz, and
wherein the metal oxides are selected from zirconates, titanates, stannates, niobates, tantalates, rare earth oxides, antimony oxides, vanadium oxides, iron oxides, strontium oxides, copper oxide, niobium oxide, tantalum oxide, yttrium oxide, CaTiO 3 , MgZrSrTiO 6 , MgTiO 3 , MgAl 2 O 4 , BaZrO 3 , BaSnO 3 , BaNb 2 O 6 , BaTa 2 O 6 , WO 3 , MnO 2 , SrZrO 3 , SnTiO 4 , ZrTiO 4 , CaZrO 3 , CaSnO 3 , CaWO 4 , MgTa 2 O 6 , MgZrO 3 , La 2 O 3 , CaZrO 3 , MgSnO 3 , MgNb 2 O 6 , SrNb 2 O 6 , MgTa 2 O 6 , Ta 2 O 3 , or a combination including at least one of the foregoing metal oxides, and the silicates are selected from Na 2 SiO 3 , Li 4 SiO 4 , BaTiSi 3 O 9 , ZrSiO 4 , CaMgSi 2 O 6 , Zn 2 SiO 4 , or a combination including at least one of the foregoing silicates;
wherein the thermoplastic composition is capable of being plated after being activated using a laser, and
wherein the composition has a dielectric constant of 4 or greater and a loss tangent of 0.01 or less.
2. The thermoplastic composition of claim 1 , wherein the thermoplastic base resin is a polyamide, a poly(arylene ether), a polyphthalamide or a combination including at least one of the foregoing thermoplastic base resins.
3. The thermoplastic composition of claim 1 , wherein the laser direct structuring additive is a heavy metal mixture oxide spinel, a copper salt, or a combination including at least one of the foregoing laser direct structuring additives.
4. The thermoplastic composition of claim 3 , wherein the laser direct structuring additive comprises copper chromium oxide spinel.
5. The thermoplastic composition of claim 1 , wherein the at least one ceramic filler is silicates, borides, carbides, nitrides, perovskites and perovskite derivatives, or a combination including at least one of the foregoing fillers having a dielectric constant of 25 or greater when measured at 900 MHz.
6. An article of manufacture comprising the composition of claim 1 .
7. The article of claim 6 , wherein the article is a personal computer, a notebook computer, a portable computer, a cell phone, a medical device, an automotive application, or an RFID application.