IP Library Granted Patent US 8,057,109
Granted Patent B2
US 8,057,109 · App. 12/468,790 · Granted Nov 15, 2011

Transceiver module with dual printed circuit boards

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Quick Facts
Patent No.
US 8,057,109
App. No.
12/468,790
Granted
Nov 15, 2011
Kind
B2
Abstract

Transceiver modules with dual printed circuit boards. In one example embodiment, a transceiver module includes first and second printed circuit boards (PCBs), a transmitter, a receiver, and a flexible circuit. The first PCB is positioned in a first plane and the second PCB is positioned in a second plane. The transmitter and the receiver are both positioned in a third plane that is offset from the first and second planes. The flexible circuit includes conductive traces that allow electrical data signals to pass between the transmitter and the receiver and the first and second PCBs.

Claims (36)

1. A transceiver module comprising:

a shell defining a protruding heat spreader;

a first printed circuit board (PCB) positioned in a first plane;

a second PCB positioned in a second plane;

a transmitter and a receiver both positioned in a third plane that is offset from the first and second planes;

a conductive mounting plate;

a flexible circuit comprising conductive traces that allow electrical data signals to pass between the transmitter and the receiver and the first and second PCBs, a portion of the flexible circuit sandwiched between the transmitter and receiver and the conductive mounting plate, and another portion of the flexible circuit defining an opening surrounding the protruding heat spreader and permitting the protruding heat spreader to physically and thermally contact the conductive mounting plate.

2. The transceiver module as recited in claim 1 , wherein the first PCB includes circuitry corresponding to the transmitter and the second PCB includes circuitry corresponding to the receiver.

3. The transceiver module as recited in claim 1 , wherein the first plane is substantially parallel to the second plane.

4. The transceiver module as recited in claim 3 , wherein the third plane is substantially orthogonal to the first plane and the second plane.

5. The transceiver module as recited in claim 4 , wherein at least a portion of the flexible circuit is positioned between the first PCB and the second PCB.

6. The transceiver module as recited in claim 1 , further comprising a multifiber push on (MPO) female connector attached to the transceiver module.

7. The transceiver module as recited in claim 1 , further comprising an electrical communications cable attached to the transceiver module.

8. The transceiver module as recited in claim 1 , wherein the conductive mounting plate is positioned in a plane that is substantially parallel to the third plane.

9. The transceiver module as recited in claim 1 , wherein the flexible circuit is attached to the conductive mounting plate with a heat-cured thermal adhesive.

10. The transceiver module as recited in claim 1 , wherein a thermal compound is positioned between the conductive mounting plate and the protruding heat spreader.

11. The transceiver module as recited in claim 1 , wherein the portion of the flexible circuit sandwiched between the transmitter and receiver and the conductive mounting plate includes one or more vias to facilitate the transfer of heat through the flexible circuit from the transmitter and receiver to the conductive mounting plate.

12. An active cable comprising:

a communications cable comprising one or more optical or electrical data transmission lines, the communications cable having first and second ends; and

first and second transceiver modules attached to the first and second ends of the communications cable, respectively, each transceiver module comprising:

a shell defining a protruding heat spreader;

a first PCB positioned in a first plane;

a second PCB positioned in a second plane;

a transmitter and a receiver both positioned in a third plane that is offset from the first and second planes; and

a conductive mounting plate;

a flexible circuit comprising conductive traces that allow electrical data signals to pass between the transmitter and the receiver and the first and second PCBs, a portion of the flexible circuit sandwiched between the transmitter and receiver and the conductive mounting plate, and another portion of the flexible circuit defining an opening surrounding the protruding heat spreader and permitting the protruding heat spreader to physically and thermally contact the conductive mounting plate.

13. The active cable as recited in claim 12 , wherein the first PCB includes circuitry corresponding to the transmitter and the second PCB includes circuitry corresponding to the receiver.

14. The active cable as recited in claim 12 , wherein the first plane is substantially parallel to the second plane.

15. The active cable as recited in claim 14 , further comprising one or more spacers positioned between the first PCB and the second PCB that maintains the first PCB substantially parallel to the second PCB.

16. The active cable as recited in claim 12 , wherein the third plane is substantially orthogonal to the first plane and the second plane.

17. The active cable as recited in claim 12 , wherein at least portions of the transmitter PCB and the second PCB flexible circuit are positioned between the flexible circuit.

18. The active cable as recited in claim 12 , wherein the conductive mounting plate is positioned in a plane that is substantially parallel to the third plane.

19. The active cable as recited in claim 12 , wherein:

the flexible circuit is attached to the conductive mounting plate with a heat-cured thermal adhesive; and

a thermal compound is positioned between the conductive mounting plate and the protruding heat spreader.

20. The active cable as recited in claim 12 , wherein the portion of the flexible circuit sandwiched between the transmitter and receiver and the conductive mounting plate includes one or more vias to facilitate the transfer of heat through the flexible circuit from the transmitter and receiver to the conductive mounting plate.

Assignments (4)
PATENT RELEASE AND REASSIGNMENT Recorded Jul 5, 2022
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
Reel/Frame 060574/0001 →
SECURITY INTEREST Recorded Jul 1, 2022
From: II-VI INCORPORATED; II-VI DELAWARE, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; PHOTOP TECHNOLOGIES, INC.; COHERENT, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 060562/0254 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 1, 2020
From: FINISAR CORPORATION
To: II-VI DELAWARE, INC.
Reel/Frame 052286/0001 →
NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Recorded Sep 25, 2019
From: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 050484/0204 →