IP Library Granted Patent US 8,054,238
Granted Patent B2
US 8,054,238 · App. 12/470,906 · Granted Nov 8, 2011

Balanced PIFA and method for manufacturing the same

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Quick Facts
Patent No.
US 8,054,238
App. No.
12/470,906
Granted
Nov 8, 2011
Kind
B2
Abstract

A balanced patched inverse F antenna comprises a radiation conductor and a balun circuit. The radiation conductor includes a main body, a first branch and a second branch. The balun circuit includes an unbalanced port, a balanced port, and first, second, third and fourth components, with the first, second, third and fourth components being serially connected. A feeding input of the unbalanced port is connected to the second and third components, a grounding wire of the unbalanced port is connected to the first and fourth components, an inverting terminal of the balanced port is connected to the first and second components, a non-inverting terminal of the balanced port is connected to the third and fourth components, and the inverting and non-inverting terminals are respectively connected to the first and second branches.

Claims (67)

1. A balanced patched inverse F antenna (PIFA), comprising:

a radiation conductor including a main body, a first branch and a second branch; and

a balun circuit including an unbalanced port, a balanced port, and first, second, third and fourth components, the first, second, third and fourth components being serially connected, wherein a feeding input of the unbalanced port is connected to the second and third components, a grounding wire of the unbalanced port is connected to the first and fourth components, an inverting terminal of the balanced port is connected to the first and second components, a non-inverting terminal of the balanced port is connected to the third and fourth components, and the inverting and non-inverting terminals are respectively connected to the first and second branches.

2. The balanced PIFA of claim 1 , wherein the first and third components are capacitors, and the second and fourth components are inductors.

3. The balanced PIFA of claim 2 , wherein the first and third components fulfill a formula of

ω

·

C

=

1

2

*

Zout

*

Zi

,

and the second and fourth components fulfill a formula of ω·L=√{square root over (2*Zout*Zin)}, where ω represents an angular frequency, C represents a capacitance, L represents an inductance, Zout represents impedance of the radiation conductor, and Zin represents impedance of the feeding input.

4. The balanced PIFA of claim 1 , wherein the radiation conductor is an F-shaped structure, and the first and second branches are protruding portions of the F-shaped structure.

5. The balanced PIFA of claim 1 , wherein the radiation conductor is substantially a 9-shaped structure.

6. The balanced PIFA of claim 1 , wherein the radiation conductor is made of a conductive material.

7. An antenna apparatus, comprising:

an antenna body, comprising:

a radiation conductor including a main body, a first branch and a second branch; and

a balun circuit including an unbalanced port, a balanced port, and first, second, third and fourth components, the first, second, third and fourth components being serially connected, wherein a feeding input of the unbalanced port is connected to the second and third components, the grounding wire of the unbalanced port is connected to the first and fourth components, an inverting terminal of the balanced port is connected to the first and second components, a non-inverting terminal of the balanced port is connected to the third and fourth components, and the inverting and non-inverting terminals are respectively connected to the first and second branches;

a radio frequency (RF) signal processing module coupled to the antenna body for processing RF signals transmitted and received by the antenna body; and

a universal serial bus (USB) interface configured to transmit signals from the RF signal processing module.

8. The antenna apparatus of claim 7 , wherein the antenna body and the RF signal processing module are a first antenna body and a first RF signal processing module, respectively, and located on a first surface of a substrate, and a second surface of the substrate opposite the first surface comprises:

a second antenna body comprising a radiation body and a balun circuit, the second antenna body configured to receive RF-band signals having a frequency band different from a frequency band of the first antenna body; and

a second RF signal processing module coupled to the USB interface for transforming RF signals of the second antenna body into a second RF signal.

9. The antenna apparatus of claim 8 , further comprising a first wireless network module, wherein the first wireless network module is coupled to the first RF signal processing module for transforming the RF signals into signals in compliance with wireless network protocols.

10. The antenna apparatus of claim 8 , wherein the second surface further comprises a second wireless network module, and the second wireless network module is configured to transform the second RF signal into signals in compliance with wireless network protocols.

11. The antenna apparatus of claim 10 , wherein the frequency band of the first antenna body is in a range of approximately 2.4 GHz to 2.5 GHz, the frequency band of the second antenna body is in a range of approximately 5.15 GHz to 5.875 GHz, and the first and second wireless network modules are configured to process signals in compliance with IEEE 802.11a, IEEE 802.11b, IEEE 802.11g or IEEE 802.11n.

12. The antenna apparatus of claim 7 , wherein the first and third components are capacitors, and the second and fourth components are inductors.

13. The antenna apparatus of claim 12 , wherein the first and third components fulfill a formula of

ω

·

C

=

1

2

*

Zout

*

Zi

,

and the second and fourth components fulfill a formula of ω·L=√{square root over (2*Zout*Zin)}, where ω represents an angular frequency, C represents a capacitance, L represents an inductor, Zout represents impedance of the radiation conductor, and Zin represents impedance of the feeding input.

14. A method for manufacturing a balanced PIFA, comprising the steps of:

forming a radiation conductor on a substrate by printing, wherein the radiation conductor has a main body, a first branch and a second branch; and

disposing a transformation circuit on the substrate, wherein the transformation circuit is connected to the radiation conductor and comprises an unbalanced port, a balanced port, and first, second, third and fourth components; the first, second, third and fourth components are serially connected, wherein a feeding input of the unbalanced port is connected to the second and third components, the grounding wire of the unbalanced port is connected to the first and fourth components, an inverting terminal of the balanced port is connected to the first and second components, a non-inverting terminal of the balanced port is connected to the third and fourth components, and the inverting and non-inverting terminals are respectively connected to the first and second branches.

15. The method of claim 14 , further comprising the steps of:

implementing the first and third components by capacitors; and

implementing the second and fourth components by inductors.

16. The method of claim 15 , wherein the first and third components fulfill a formula of

ω

·

C

=

1

2

*

Zout

*

Zi

,

and the second and fourth components fulfill a formula of ω·L=√{square root over (2*Zout*Zin)}, where ω represents an angular frequency, C represents a capacitance, L represents an inductor, Zout represents impedance of the radiation conductor, and Zin represents impedance of the feeding input.

17. The method of claim 14 , wherein the forming step includes the step of forming an F-shaped conductive structure by printing on the substrate.

18. The method of claim 14 , wherein the forming step includes the step of forming a 9-shaped conductive structure by printing on the substrate.

Assignments (2)
MERGER Recorded Aug 27, 2014
From: RALINK TECHNOLOGY CORPORATION
To: MEDIATEK INC.
Reel/Frame 033645/0819 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 22, 2009
From: LIN, JUNN YI
To: RALINK TECHNOLOGY CORPORATION
Reel/Frame 022726/0271 →