IP Library Granted Patent US 8,194,711
Granted Patent B2
US 8,194,711 · App. 12/470,919 · Granted Jun 5, 2012

Nitride semiconductor laser device

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Quick Facts
Patent No.
US 8,194,711
App. No.
12/470,919
Granted
Jun 5, 2012
Kind
B2
Abstract

A nitride semiconductor laser device includes a multilayer structure including a plurality of nitride semiconductor layers including a light emitting layer, the multilayer structure having cavity facets facing each other, and a plurality of protective films made of a dielectric material provided on one of the cavity facets. The protective films include a first protective film, a second protective film and a third protective film. The first protective film contacts the cavity facet and is made of aluminum nitride. The second protective film is provided on a surface opposite to the cavity facet of the first protective film and is made of a material different from that of the first protective film. The third protective film is provided on a surface opposite to the first protective film of the second protective film and is made of the same material as that of the first protective film.

Claims (16)

1. A nitride semiconductor laser device comprising:

a multilayer structure including a plurality of nitride semiconductor layers including a light emitting layer, the multilayer structure having cavity facets facing each other; and

a plurality of protective films made of a dielectric material provided on one of the cavity facets,

wherein the plurality of protective films include a first protective film, a second protective film and a third protective film,

the first protective film contacts the cavity facet and is made of aluminum nitride,

the second protective film is provided on a surface opposite to the cavity facet of the first protective film and is made of a material different from that of the first protective film,

the third protective film is provided on a surface opposite to the first protective film of the second protective film and is made of the same material as that of the first protective film,

the first and third protective films contain silicon, and

the first protective film has a higher silicon concentration than that of the third protective film.

2. The nitride semiconductor laser device of claim 1 , wherein

the plurality of protective films include a fourth protective film provided on a surface opposite to the second protective film of the third protective film, and

the fourth protective film is made of aluminum oxide or aluminum oxynitride.

3. The nitride semiconductor laser device of claim 2 , wherein

the plurality of protective films include a fifth protective film provided on a surface opposite to the third protective film of the fourth protective film, and

the fifth protective film is made of the same material as that of the first protective film.

4. The nitride semiconductor laser device of claim 1 , wherein the second protective film is made of aluminum oxide, aluminum oxynitride, silicon oxide or silicon oxynitride.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 27, 2020
From: PANASONIC CORPORATION
To: PANASONIC SEMICONDUCTOR SOLUTIONS CO., LTD.
Reel/Frame 052755/0917 →