Pressure sensor apparatus
View Patent ↗A high pressure, miniature pressure sensor has a cup-shaped housing having an open end closed by a metal substrate. A raised stress isolation pedestal portion is formed on the substrate that receives a stress isolation glass pedestal element and in turn a silicon pressure sense element, all having closely matched CTEs to minimize temperature induced stresses. A fluid passageway is formed through the substrate and glass pedestal and an O-ring is placed around the passageway on the lower side of the substrate. A flexible circuit having a slit tail formed with two lobes for receipt respectively in the housing and on the substrate allows easy access of a solder iron during assembly. Mounting flanges extend from the substrate to facilitate mounting of sensor and minimize transfer of mounting stresses to the sense element.
1. A high pressure, liquid tight, miniature pressure sensor comprising a substrate, a cup shaped housing having an open end closed by the substrate forming a chamber, the substrate formed with a centrally located raised stress isolation pedestal portion, a stress isolation glass pedestal element adhered to the stress isolation pedestal portion of the substrate, a pressure responsive sense element fixed to the stress isolation pedestal element, a fluid passageway extending through the substrate including the stress isolation pedestal portion and stress isolation pedestal element in communication with the pressure responsive sense element, conditioning electronics disposed in the enclosure and terminals extending from a location exterior of the housing into the housing for connection to the conditioning electronics and pressure responsive sense element, the pressure responsive sense element, the stress isolation pedestal element and the substrate having closely matched coefficients of thermal expansion to minimize stress forces transferred to the sense element.
2. A pressure sensor according to claim 1 in which the substrate is formed of ASTM F-15.
3. A pressure sensor according to claim 2 in which the glass pedestal element is adhered to the pedestal portion of the substrate by a resin.
4. A pressure sensor according to claim 3 in which the resin is bismaleimide (BMI).
5. A pressure sensor according to claim 2 in which the glass pedestal element is adhered to the pedestal portion of the substrate by leaded glass.
6. A pressure sensor according to claim 1 in which a mounting flange extends radially outwardly from the substrate thereby minimizing transfer of mounting forces to the pedestal portion of the substrate.
7. A pressure sensor according to claim 1 in which an elastomeric element seat is disposed on the bottom surface of the substrate around the fluid passageway.
8. A pressure sensor according to claim 7 in which the elastomeric element seat comprises a recess formed in the bottom surface of the substrate.
9. A pressure sensor according to claim 7 in which the housing has a cylindrical side wall and further comprising a ring matching the cylindrical side wall and aligned therewith attached to the bottom surface of the substrate, the ring forming a recess which serves as the elastomeric element seat.
10. A pressure sensor according to claim 9 further comprising a mounting flange that extends radially outwardly from the substrate thereby minimizing the transfer of mounting forces to the pedestal portion of the substrate.
11. A pressure sensor according to claim 7 further comprising an elastomeric element placed in the elastomeric element seat, the elastomeric element having a thickness sufficiently greater than the depth of the recess to prevent direct engagement between the substrate and a customer's equipment that receives the sensor.
12. A pressure sensor according to claim 1 in which the substrate and housing are generally cylindrical, the chamber in the housing has a top surface and the substrate has a flat surface adjacent to the pedestal portion, further comprising a flexible circuit having two cylindrical lobes spaced apart by a bridge portion, one lobe is received on the top surface of the chamber and the other lobe is formed with a cut-out and is received on the flat surface of the substrate with the pedestal portion extending through the cut-out in the said other lobe, the bridge portion being slit into the lobes to provide a selected length of the bridge to allow separation of the housing and substrate after attachment of the flexible circuit to the respective housing and substrate to facilitate soldering operations during assembly of the sensor.
13. A pressure sensor according to claim 12 in which the length L of the bridge portion is determined by the following formula in which all dimensions are in millimeters:
L =0.242*(housing wall height)+0.518*(substrate OD)+0.414*(housing OD).