Semiconductor device including a magnetic tunnel junction and method of manufacturing the same
To provide a semiconductor device that has an improved adhesion between a bottom conductive layer and a protection film protecting an MTJ element. This semiconductor device includes a bottom electrode formed over a semiconductor substrate, an MTJ element part formed over a part of the bottom electrode by lamination of a bottom magnetic film, an insulating film, a top magnetic film, and a top electrode in this order, and a protection film formed over the bottom electrode so as to cover the MTJ element part, wherein the bottom electrode is formed by amorphized metal nitride and the protection film is formed by an insulating film containing nitrogen.
1. A semiconductor device, comprising:
a bottom electrode formed over a semiconductor substrate;
a Magnetic Tunnel Junction (MTJ) element part formed over a part of the bottom electrode by laminating a bottom magnetic film, an insulating film, a top magnetic film, and a top electrode in this order; and
a protection film formed over the bottom electrode so as to cover the MTJ element part, the protection film partly making direct physical contact with the bottom electrode,
wherein:
the bottom electrode is formed by tantalum nitride (TaN), and
the protection film is formed by an insulating film containing nitrogen.
2. A semiconductor device, comprising:
a bottom electrode formed over a semiconductor substrate;
a Magnetic Tunnel Junction (MTJ) element part formed over a part of the bottom electrode by laminating a bottom magnetic film, an insulating film, a top magnetic film, and a top electrode in this order; and
a protection film formed over the bottom electrode so as to cover the MTJ element part, the protection film partly making direct physical contact with the bottom electrode,
wherein:
the bottom electrode is formed by amorphized metal nitride, and
the protection film is formed by an insulating film containing nitrogen.
3. The semiconductor device according to claim 2 , wherein the amorphized metal nitride is amorphized tantalum nitride (TaN).
4. A method of manufacturing a semiconductor device, comprising steps of:
(a) forming a bottom electrode over a semiconductor substrate;
(b) forming a Magnetic Tunnel Junction (MTJ) element part over a part of the bottom electrode by laminating a bottom magnetic film, an insulating film, a top magnetic film, and a top electrode in this order; and
(c) forming a protection film over the bottom electrode so as to cover the MTJ element part and partly making direct physical contact with the bottom electrode,
wherein:
in the step (a), the bottom electrode is formed by amorphized metal nitride, and
in the step (c), the protection film is formed by an insulating film containing nitrogen.
5. The method of manufacturing a semiconductor device according to claim 4 ,
wherein the amorphized metal nitride is amorphized tantalum nitride (TaN).
6. A semiconductor device, comprising:
a bottom electrode formed over a semiconductor substrate;
a Magnetic Tunnel Junction (MTJ) element part formed over a part of the bottom electrode by laminating a bottom magnetic film, an insulating film, a top magnetic film, and a top electrode in this order; and
a protection film formed over the bottom electrode so as to cover the MTJ element part,
wherein:
the protection film is formed by an insulating film containing nitrogen,
the bottom electrode includes a plurality of conductive layers,
a top conductive layer of the plurality of conductive layers is formed by an amorphized metal nitride, and
other conductive layers of the plurality of conductive layers are formed by a metal having a resistance lower than that of the amorphized metal nitride.
7. A method of manufacturing a semiconductor device, comprising steps of:
(a) forming a bottom electrode over a semiconductor substrate;
(b) forming a Magnetic Tunnel Junction (MTJ) element part over a part of the bottom electrode by laminating a bottom magnetic film, an insulating film, a top magnetic film, and a top electrode in this order; and
(c) forming a protection film over the bottom electrode so as to cover the MTJ element part, wherein:
in the step (c), the protection film is formed by an insulating film containing nitrogen;
in the step (a), the bottom electrode includes a plurality of conductive layers;
a top conductive layer of the plurality of conductive layers is formed by an amorphized metal nitride, and
other conductive layers of the plurality of conductive layers are formed by a metal having resistance lower than that of the amorphized metal nitride.