IP Library Granted Patent US 8,029,095
Granted Patent B2
US 8,029,095 · App. 12/475,592 · Granted Oct 4, 2011

Pagewidth printhead with ink supply reservoirs integrated into support member

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Quick Facts
Patent No.
US 8,029,095
App. No.
12/475,592
Granted
Oct 4, 2011
Kind
B2
Abstract

Provided is a pagewidth printhead for an inkjet printer. The printhead has a printhead integrated circuit, a molding for supporting the printhead integrated circuit and distributing ink along the printhead integrated circuit, a core element bonded to the molding, and, an outer shell with a first metal layer sandwiched between two second metal layers, so that an effective coefficient of thermal expansion of said shell is substantially equal to that of the printhead integrated circuit. The core element defines ink reservoirs in fluid communication with the molding.

Claims (10)

1. A pagewidth printhead for an inkjet printer, said pagewidth printhead comprising:

a printhead integrated circuit;

a molding for supporting the printhead integrated circuit and distributing ink along the printhead integrated circuit;

a core element bonded to the molding, the core element defining ink reservoirs in fluid communication with the molding; and,

an outer shell with a first metal layer sandwiched between two second metal layers, so that an effective coefficient of thermal expansion of said shell is substantially equal to that of the printhead integrated circuit.

2. The pagewidth printhead of claim 1 , wherein the first metal layers each have a coefficient of thermal expansion equal to, or more than, 2.5×10-6 m/° C.

3. The pagewidth printhead of claim 1 , wherein the second metal layer has a coefficient of thermal expansion of about 1.3×10-6 m/° C.

4. The pagewidth printhead of claim 1 , wherein the effective coefficient of thermal expansion of said shell is substantially equal to that of silicon.

5. The pagewidth printhead of claim 1 , wherein the core element is molded from a liquid crystal polymer (LCP).

6. The pagewidth printhead assembly of claim 1 , wherein a plurality of the printhead integrated circuits are supported on the molding.

Assignments (2)
CHANGE OF NAME Recorded Jun 25, 2014
From: ZAMTEC LIMITED
To: MEMJET TECHNOLOGY LIMITED
Reel/Frame 033244/0276 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 10, 2012
From: SILVERBROOK RESEARCH PTY. LIMITED AND CLAMATE PTY LIMITED
To: ZAMTEC LIMITED
Reel/Frame 028522/0610 →