Method of forming a dielectric layer on a semiconductor light emitting device
View Patent ↗A semiconductor structure comprising a light emitting layer disposed between an n-type region and a p-type region is formed. A portion of the light emitting layer and the p-type region are removed to expose a portion of the n-type region. A first metal contact is formed on an exposed portion of the n-type region and a second metal contact is formed on a remaining portion of the p-type region. The first and second metal contacts are formed on a same side of the semiconductor structure. A dielectric material is disposed between the first and second metal contacts. The dielectric material is in direct contact with a portion of the semiconductor structure, a portion of the first metal contact, and a portion of the second metal contact. A surface of the device is then planarized by removing a portion of at least one of the first metal contact, the second metal contact, and the dielectric material.
1. A method comprising:
forming a semiconductor structure comprising a light emitting layer disposed between an n-type region and a p-type region;
removing a portion of the light emitting layer and the p-type region to expose a portion of the n-type region;
forming a first metal contact on an exposed portion of the n-type region and a second metal contact on a remaining portion of the p-type region, wherein the first and second metal contacts are formed on a same side of the semiconductor structure; and
disposing a dielectric material between the first and second metal contacts, wherein the dielectric material is in direct contact with a portion of the semiconductor structure, a portion of the first metal contact, and a portion of the second metal contact; and
forming a planar surface, the planar surface including a surface of the first metal contact, a surface of the second metal contact, and a surface of the dielectric material, by removing a portion of at least one of the first metal contact, the second metal contact, and the dielectric material.
2. The method of claim 1 wherein forming a first metal contact and a second metal contact occurs before disposing a dielectric material between the first and second metal contacts.
3. The method of claim 1 wherein:
disposing a dielectric material occurs before forming a first metal contact and a second metal contact; and
disposing a dielectric layer comprises:
after removing a portion of the light emitting layer and the p-type region, forming a dielectric material over the semiconductor structure; and
removing portions of the dielectric material to expose portions of the n-type region and the p-type region on which the first and second metal contacts are disposed.
4. The method of claim 1 further comprising etching away a portion of the dielectric material between the first and second metal contacts, after forming a planar surface.
5. The method of claim 1 wherein the dielectric material is one of a polymer, polyimide, and a benzocyclobutene-based material, and wherein disposing a dielectric material comprises disposing the dielectric material by spin-on coating.
6. The method of claim 1 wherein the dielectric material is one of an inorganic material, silicon dioxide, and silicon nitride, and wherein disposing a dielectric material comprises disposing the dielectric material by one of chemical vapor deposition, plasma enhanced chemical vapor deposition, and a vacuum deposition technique.
7. The method of claim 1 wherein forming a planar surface comprises removing material by chemical mechanical polishing.
8. The method of claim 1 wherein after forming a planar surface, dielectric material is disposed over the first metal contact and the second metal contact, the method further comprising:
forming a first opening in the dielectric material to expose a portion of the first metal contact;
forming a second opening in the dielectric material to expose a portion of the second metal contact;
disposing metal in the first and second openings;
forming a third metal contact in direct contact with the metal in the first opening; and
forming a fourth metal contact in direct contact with the metal in the second opening.
9. The method of claim 1 wherein:
at least a portion of the first metal contact substantially surrounds the second metal contact; and
a segment of the portion first metal contact which substantially surrounds the second metal contact is omitted and replaced with a dielectric bridge;
the method further comprising:
connecting the first and second metal contacts to a mount such that the dielectric bridge is aligned with a contact pad on the mount, wherein the contact pad is electrically connected to the second metal contact.
10. The method of claim 1 wherein forming a semiconductor structure comprises growing the semiconductor structure on a growth substrate, the method further comprising:
connecting the first and second metal contacts to a mount; and
removing the growth substrate.
11. The method of claim 1 further comprising:
disposing a compliant bonding structure between the semiconductor structure and a mount; and
bonding the semiconductor structure to the mount, wherein bonding causes the compliant bonding structure to collapse such that the compliant bonding structure electrically and mechanically connects the semiconductor structure to the mount and wherein the compliant bonding structure remains in a solid phase during bonding.
12. The method of claim 11 wherein the compliant bonding structure comprises a plurality of metal bumps.
13. The method of claim 12 wherein the bumps are gold.