IP Library Granted Patent US 8,158,001
Granted Patent B2
US 8,158,001 · App. 12/477,340 · Granted Apr 17, 2012

Wafer-shaped hollow fiber module for in-line use in a piping system

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,158,001
App. No.
12/477,340
Granted
Apr 17, 2012
Kind
B2
Abstract

A wafer-shaped hollow fiber module adapted for in-line use in a piping system. The piping system may include two standard bolted flange connections, and at least one wafer-shaped hollow fiber module sealed between the two standard bolted flange connections. The wafer shaped hollow fiber module includes: a cylindrical housing having an open end and a closed end having a first sealing surface and an inlet port; at least one side port through the cylindrical housing; an end cap united to the open end having a second sealing surface and an outlet port.

Claims (60)

1. A piping system including:

two standard bolted flange connections; and

at least one wafer-shaped hollow fiber module being sealed between said two standard bolted flange connections;

said two standard bolted flange connections being connected to each other by a plurality of bolts where said wafer shaped hollow fiber module being positioned between said two standard bolted flange connections and in between said plurality of bolts;

said wafer shaped hollow fiber module comprising:

a cylindrical housing having an open end and a closed end;

said closed end having a first sealing surface and an inlet port;

at least one side port through said cylindrical housing;

an end cap united to said open end;

said end cap having a second sealing surface and an outlet port;

a stack of membrane mats within said cylindrical housing comprising a plurality of hollow fibers;

a potting material bonding the membrane mats of said stack to each other and simultaneously bonding one end of said stack to said closed end of said cylindrical housing and bonding the other end of said stack to said end cap, thereby defining an internal chamber and at least one external chamber within said housing; and

said inlet port and said outlet port being in communication with said internal chamber.

2. The piping system of claim 1 wherein said piping system further including:

a housing diameter defined by the diameter of said cylindrical housing;

a bolt circle diameter defined by the diameter from the center of said bolted flange connections to the center of each said bolt; and

a bolt hole diameter defined by each bolt hole;

where said housing diameter being approximate to the difference between said bolt circle diameter and said bolt hole diameter.

3. The piping system of claim 2 wherein said housing diameter being slightly smaller than the difference between said bolt circle diameter and said bolt hole diameter.

4. The piping system of claim 1 further including

a first seal sealing said first sealing surface to one of the bolted flange connections;

said first sealing surface having a first outside radius defined by said cylindrical housing and a first inside radius defined by said inlet port, where the difference between said first outside radius and said first inside radius being at least 0.1 inches; and

a second seal sealing said second sealing surface to the other bolted flange connection;

said second sealing surface having a second outside radius defined by said end cap and a second inside radius defined by said outlet port, where the difference between said second outside radius and said second inside radius being at least 0.1 inches.

5. The piping system of claim 1 wherein said two standard bolted flange connections being connected in-line with a conduit being a pipe, a duct, a tube, or any conduit of the like.

6. The piping system of claim 1 wherein said internal chamber of said wafer-shaped hollow fiber module creating a pressure drop between said two standard bolt flanges of less than 1.5 psi at a gas flow rate of 10 liters/minute, where said internal chamber having a diameter of 4 inches.

7. A wafer-shaped hollow fiber module comprising:

a cylindrical housing having an open end and a closed end;

said closed end having a first sealing surface and an inlet port;

said first sealing surface having a first outside radius defined by said cylindrical housing and a first inside radius defined by said inlet port, where the difference between said first outside radius and said first inside radius being at least 0.1 inches;

at least one side port through said cylindrical housing;

an end cap united to said open end;

said end cap having a second sealing surface and an outlet port;

said second sealing surface having a second outside radius defined by said end cap and a second inside radius defined by said outlet port, where the difference between said second outside radius and said second inside radius being at least 0.1 inches;

a stack of membrane mats within said cylindrical housing comprising a plurality of hollow fiber membranes;

a potting material bonding the membrane mats of said stack to each other and simultaneously bonding one end of said stack to said closed end of said cylindrical housing and bonding the other end of said stack to said end cap, thereby defining an internal chamber and at least one external chamber within said housing; and

said inlet port and said outlet port being in communication with said internal chamber;

whereby, said wafer-shaped hollow fiber module being adapted to work in-line with a conduit via two standard bolted flange connections;

wherein said two standard bolted flange connections being connected to each other by a plurality of bolts where said wafer shaped hollow fiber module being positioned between said two standard bolted flange connections and in between said plurality of bolts.

8. The wafer-shaped hollow fiber module of claim 7 further including:

a housing diameter defined by the diameter of said cylindrical housing;

a bolt circle diameter defined by the diameter from the center of said bolted flange connections to the center of each said bolt; and

a bolt hole diameter defined by each bolt hole;

where said housing diameter being approximate to the difference between said bolt circle diameter and said bolt hole diameter.

9. The wafer-shaped hollow fiber module of claim 8 where said housing diameter being approximately equal to the difference between said bolt circle diameter and said bolt hole diameter.

10. The wafer-shaped hollow fiber module of claim 7 where said stack of membrane mats including:

being positioned within said housing where each said membrane mat being stacked substantially perpendicular to the longitudinal axis of said housing;

being stacked so that a peripheral edge of each said membrane mat is aligned with said peripheral edge of the membrane mat below it;

being dimensioned slightly smaller than said cylindrical housing so that when stacked and inserted into said housing a headspace is created between said peripheral edges of said mats and said housing; and

said hollow fibers extending from said internal chamber through said potting material into said external chambers.

11. The wafer-shaped hollow fiber module of claim 8 having:

one said side port and one said external chamber;

said one external chamber continuously surrounds said internal chamber allowing said one side port to be in communication with said one external chamber; and

said cylindrical housing having a cylindrical internal shape.

12. The wafer-shaped hollow fiber module of claim 7 comprising:

two side ports on opposite sides of said cylindrical housing; and

two external chambers separated by said potting material allowing a gas to be swept through said membrane contactor;

one of said side ports communicating with one of said external chambers and the other side port communicating with the other external chamber; and

said cylindrical housing having a Double ‘D’ internal shape.

13. The wafer-shaped hollow fiber module of claim 7 , wherein said module is adapted to be used alone or as one of a plurality of such modules stacked end to end.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 3, 2015
From: CELGARD, LLC
To: 3M INNOVATIVE PROPERTES COMPANY
Reel/Frame 036947/0478 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN UNITED STATES PATENTS Recorded Aug 27, 2015
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: CELGARD, LLC (F/K/A/ CELGARD, INC.)
Reel/Frame 036485/0267 →
PATENT SECURITY AGREEMENT Recorded Apr 8, 2014
From: CELGARD, LLC (F/K/A CELGARD, INC.)
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 032631/0655 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 3, 2009
From: TAYLOR, GARETH P.; SENGUPTA, AMITAVA
To: CELGARD LLC
Reel/Frame 022774/0799 →