IP Library Granted Patent US 8,080,618
Granted Patent B2
US 8,080,618 · App. 12/477,530 · Granted Dec 20, 2011

Thermoplastic resin composition with good heat stability, light stability, and impact strength

Assignee: Cheil Industries Inc.
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Quick Facts
Patent No.
US 8,080,618
App. No.
12/477,530
Granted
Dec 20, 2011
Kind
B2
Abstract

Disclosed herein is a thermoplastic resin composition with good heat stability, light stability and impact strength. In an exemplary embodiment, the thermoplastic resin composition comprises (A) about 10 to about 99 parts by weight of an epoxy group-containing styrenic resin; (B) about 1 to about 90 parts by weight of a polyester resin; (C) about 0.1 to about 10 parts by weight of a thermoplastic polyester resin comprising a cycloaliphatic diol such as cyclohexane dimethanol, per about 100 parts by weight of a base resin comprising (A)+(B); (D) about 0.05 to about 2 parts by weight of a hindered phenolic compound, per about 100 parts by weight of a base resin comprising (A)+(B); (E) about 0.05 to about 4 parts by weight of a phosphite compound, per about 100 parts by weight of a base resin comprising (A)+(B); and (F) about 0.2 to about 6 parts by weight of a compound comprising a HALS compound, benzotriazol based compound, or a combination thereof, per about 100 parts by weight of a base resin comprising (A)+(B).

Claims (34)

1. A thermoplastic resin composition comprising:

about 100 parts by weight of a binary base resin comprising (A) about 10 to about 99 parts by weight of an epoxy group-containing styrenic resin and (B) about 1 to about 90 parts by weight of a polyester resin; wherein said epoxy group-containing styrenic resin (A) comprises about 5 to about 50% by weight of an epoxy group-containing vinyl copolymer resin (A 1 ) and about 50 to about 95% by weight of a rubber modified styrenic copolymer resin (A 2 );

(C) about 0.1 to about 10 parts by weight of a thermoplastic polyester resin, per about 100 parts by weight of the binary base resin; wherein said thermoplastic polyester resin (C) is prepared by polymerization of acid components and diol components, and the diol components comprise a cycloaliphatic diol;

(D) about 0.05 to about 2 parts by weight of a hindered phenolic compound, per about 100 parts by weight of the binary base resin;

(E) about 0.05 to about 4 parts by weight of a phosphite compound, per about 100 parts by weight of the binary base resin; and

(F) about 0.2 to about 6 parts by weight of a compound comprising a HALS compound, benzotriazol based compound, or a combination thereof, per about 100 parts by weight of the binary base resin.

2. The thermoplastic resin composition of claim 1 , wherein said epoxy group-containing vinyl copolymer resin (A 1 ) is a copolymer comprising about 0.02 to about 5 mol % of an epoxy compound (A 11 ) and about 95 about 99.98 mol % of a vinyl compound (A 12 ).

3. The thermoplastic resin composition of claim 2 , wherein said epoxy compound (A 11 ) is represented by the following chemical formula 1:

wherein:

R 1 , R 2 , R 3 , R 6 , R 7 and R 8 are each independently hydrogen, saturated or unsaturated C 1 -C 12 alkyl, C 6 -C 14 aryl, or saturated or unsaturated C 1 -C 12 alkyl-substituted C 6 -C 14 aryl; and

Y is an ether group (—O—), carboxyl group (-0-[C═O]—, —[O═C]—O—), C 1 -C 12 alkylene, C 6 -C 14 arylene, or saturated or unsaturated C 1 -C 12 alkyl-substituted C 6 -C 14 arylene;

with the proviso that when Y is an ether group (—O—) or carboxyl group (-0-[C═O]—, —[O═C]—O—), R 4 and R 5 are each independently C 1 -C 12 alkylene, C 6 -C 14 arylene or saturated or unsaturated C 1 -C 12 alkyl-substituted C 6 -C 14 arylene, and x is 0 or 1; and when Y is C 1 -C 12 alkylene, C 6 -C 14 arylene or saturated or unsaturated C 1 -C 12 alkyl-substituted C 6 -C 14 arylene, Y represents a (R 4 —Y—R 5 ) structure.

4. The thermoplastic resin composition of claim 3 , wherein said epoxy compound (A 11 ) comprises epoxy alkyl acrylate, allyl glycidyl ester, aryl glycidyl ester, glycidyl methacrylate, glycidyl acrylate, butadiene monooxide, vinyl glycidyl ether, glycidyl itaconate or a combination thereof.

5. The thermoplastic resin composition of claim 1 , wherein said rubber modified styrenic copolymer resin (A 2 ) comprises (A 21 ) about 20 to about 100% by weight of a graft copolymer resin and (A 22 ) about 0 to about 80% by weight of a copolymer resin.

6. The thermoplastic resin composition of claim 1 , wherein said polyester resin (B) has an intrinsic viscosity of about 0.3 to about 1.15 dL/g.

7. The thermoplastic resin composition of claim 1 , wherein said thermoplastic polyester resin (C) has an intrinsic viscosity of about 0.5 to about 1.0 dL/g.

8. The thermoplastic resin composition of claim 1 , wherein said thermoplastic polyester resin (C) is prepared by polymerization of acid components and diol components, and the diol components comprise 1,4-cyclohexane dimethanol.

9. The thermoplastic resin composition of claim 8 , wherein the 1,4-cyclohexane dimethanol is provided in an amount of about 0.1 to about 99 mol %, per total acid components.

10. The thermoplastic resin composition of claim 8 , wherein the 1,4-cyclohexane dimethanol is provided in an amount of about 20 to about 60 mol % per total acid components.

11. The thermoplastic resin composition of claim 1 , wherein said hindered phenolic compound (D) comprises octadecyl-3-(4-hydroxy-3,5-di-tert-butylphenyl)-propionate, 2,2-methylenebis(4-methyl-6-butylphenol), 1,3,5-tri-methyl-2,4,6-tri(3,5-di-tert-butyl-4-hydroxybenzyl)benzene, or a combination thereof.

12. The thermoplastic resin composition of claim 1 , wherein said phosphite compound (E) comprises triphenyl phosphate, tri(nonyl phenyl)phosphite, triisodecyl phosphite, diphenyl-isooctyl-phosphite, bis(2,6-di-tert-butyl-4-methylphenyl)pentaerythritol diphosphite, tris(2,4-di-tert-butylphenyl)phosphite, or a combination thereof.

13. The thermoplastic resin composition of claim 1 , wherein said HALS compound (F) comprises bis(2,2,6,6-tetramethyl-4-piperidinyl)sebacate, bis(1,2,2,6,6-pentamethyl-4-piperidinyl)sebacate, or a combination thereof.

14. The thermoplastic resin composition of claim 1 , wherein said benzotriazol based compound (F) comprises 2-(2-hydroxy-5-methyl phenyl-benzotriazol, 2(-5-chloro-2h benzotriazol-2-yl)-4,6-bis(1,1-dimethylethyl)-phenol, 2-(2h-benzotriazol-2-yl)-4-(1,1,3,3-tetramethylbutyl)phenol, 2-(4,6-diphenyl-1,3,5-triazin-2-yl)-5-hexyloxy-phenol, or a combination thereof.

15. The thermoplastic resin composition of claim 1 , wherein said resin composition comprises:

about 100 parts by weight of said binary resin comprising (A) about 50 to about 75 parts by weight of said epoxy group-containing styrenic resin and (B) about 25 to about 50 parts by weight of said polyester resin;

(C) about 1 to about 5 parts by weight of said thermoplastic polyester resin per about 100 parts by weight of the binary base resin;

(D) about 0.1 to about 0.5 parts by weight of said hindered phenolic compound, per about 100 parts by weight of the binary base resin;

(E) about 0.1 to about 0.5 parts by weight of said phosphite compound, per about 100 parts by weight of the binary base resin; and

(F) about 0.3 to about 2 parts by weight of said HALS compound, benzotriazol based compound or combination thereof, per about 100 parts by weight of the binary base resin.

16. The thermoplastic resin composition of claim 1 , further comprising at least one additive comprising an antistatic agent, plasticizer, lubricant, thermal stabilizer, antioxidant, light stabilizer, compatibilizer, releasing agent, dispersant, anti-dripping agent, inorganic filler, dye, pigment, flame retardant, or a combination thereof.

17. The thermoplastic resin composition of claim 1 , wherein said resin composition has an Izod impact strength (ASTM D 256, ⅛″ notch) of about 50 to about 100 kgf·cm/cm measured in accordance with ASTM D-256 using ⅛″ thick specimens; and exhibits a color change (ΔE) of about 0.1 to about 0.9 measured using a colorimeter (Minolta 3600D) for a specimen with a retention time for 20 minutes after injecting with a 10 oz injection molding machine at 250° C. and a color change (ΔE) of about 0.1 to about 1.8 measured using a colorimeter (Minolta 3600D) accordance with ASTM D 4459 for a specimen exposed for 300 hours.

18. The thermoplastic resin composition of claim 1 , wherein (B) is a crystalline polyester resin.

19. The thermoplastic resin composition of claim 18 , comprising (B) about 1 to about 50 parts by weight of crystalline polyester resin.

20. A molded article produced from the thermoplastic resin composition as defined by claim 1 .

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 30, 2017
From: SAMSUNG SDI CO., LTD.
To: LOTTE ADVANCED MATERIALS CO., LTD.
Reel/Frame 042114/0895 →
MERGER Recorded Jul 14, 2016
From: CHEIL INDUSTRIES INC.
To: SAMSUNG SDI CO., LTD.
Reel/Frame 039360/0858 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 3, 2009
From: KIM, JUN MYUNG; CHOI, JIN HWAN; PARK, JEE KWON; LEE, JAE WON
To: CHEIL INDUSTRIES INC.
Reel/Frame 022775/0093 →
Priority Claims (1)
KR 10-2008-0057852 · Jun 19, 2008 · national
Continuity (1)
Related Publication 20090318588A1 · Dec 24, 2009