ELECTRONIC COMPONENT ACCOMMODATING DEVICE
An electronic component accommodating device which can be stacked in plural, the electronic component accommodating device includes an upper surface side wall part extending from an upper surface of the electronic component accommodating device, the upper surface side wall part being positioned close to a flange extending from a lower surface of another electronic component accommodating device stacked on the electronic component accommodating device, wherein a side surface of the upper surface side wall part a side end part of the electronic component accommodating device is formed in a taper shape and has an inclination angle from a horizontal surface, the inclination angle being equal to or less than 60 degrees.
1 . An electronic component accommodating device which can be stacked in plural, the electronic component accommodating device comprising:
an upper surface side wall part extending from an upper surface of the electronic component accommodating device, the upper surface side wall part being positioned close to a flange extending from a lower surface of another electronic component accommodating device stacked on the electronic component accommodating device,
wherein a side surface of the upper surface side wall part a side end part of the electronic component accommodating device is formed in a taper shape and has an inclination angle from a horizontal surface, the inclination angle being equal to or less than 60 degrees.
2 . The electronic component accommodating device as claimed in claim 1 ,
wherein the upper surface side wall part forms a side wall part of a concave-shape accommodating part positioned at an outermost side of the surface of the electronic component accommodating device.
3 . The electronic component accommodating device as claimed in claim 2 ,
wherein the electronic component is accommodated in the concave-shape accommodating part.
4 . The electronic component accommodating device as claimed in claim 1 ,
wherein, if a warp is generated where a substantially center part of the other electronic component accommodating device is bent upward, a lower edge part of the flange of the other electronic component accommodating device slides on the side surface of the upper surface side wall part of the electronic component accommodating device.
5 . The electronic component accommodating device as claimed in claim 1 ,
wherein any portion of the side surface of the upper surface side wall part has an inclination angle from the horizontal surface, the inclination angle being equal to or less than 60 degrees.
6 . The electronic component accommodating device as claimed in claim 1 ,
wherein a side surface of the flange at a center side of the other electronic component accommodating device is formed in a taper manner; and
the side surface of the flange has an inclination angle substantially equal to the inclination angle of the side surface of the upper surface side wall part.
7 . The electronic component accommodating device as claimed in claim 6 ,
wherein, if a warp is generated where a substantially center part of the other electronic component accommodating device is bent upward, the side surface of the flange is received by the side surface of the upper surface side wall part.
8 . The electronic component accommodating device as claimed in claim 1 ,
wherein, the electronic component accommodating device is made of plastic resin.
9 . An electronic component accommodating device which can be stacked in plural, the electronic component accommodating device comprising:
an upper surface side wall part extending from an upper surface of the electronic component accommodating device, the upper surface side wall part being positioned close to a flange extending from a lower surface of another electronic component accommodating device stacked on the electronic component accommodating device,
wherein the upper surface side wall part includes a side surface positioned at a side end part side of the electronic component accommodating device; and
the side surface includes a first surface formed in a taper manner from the upper surface of the electronic component accommodating device, the first surface having an inclination angle from a horizontal surface equal to or less than 60 degrees.
10 . The electronic component accommodating device as claimed in claim 9 ,
wherein the side surface of the upper surface side wall part has an angle from the horizontal surface different from the inclination angle of the first surface;
the surface of the upper surface side wall part includes a second surface extending from the first surface, the second surface having an angle from the horizontal surface, the angle being different from the inclination of the first surface.
11 . The electronic component accommodating device as claimed in claim 9 ,
wherein, if a warp is generated where a substantially center part of the other electronic component accommodating device is bent upward, a lower edge part of the flange of the other electronic component accommodating device slides on the first surface of the side surface of the upper surface side wall part of the electronic component accommodating device.