IP Library Granted Patent US 8,061,806
Granted Patent B2
US 8,061,806 · App. 12/478,717 · Granted Nov 22, 2011

Ejection nozzle with multiple bend actuators

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Quick Facts
Patent No.
US 8,061,806
App. No.
12/478,717
Granted
Nov 22, 2011
Kind
B2
Abstract

A inkjet nozzle arrangement that has a substrate assembly defining an ink inlet and a static wall surrounding the ink inlet. A roof structure defining a movable wall arranged to telescopically engage said static wall, the roof structure further defining an ink ejection port in fluid communication with said ink inlet. A pair of actuator assemblies is mounted to the substrate assembly and the roof structure for substantially rectilinear movement of the roof structure toward the substrate assembly to eject ink through the ink ejection port.

Claims (13)

1. A nozzle arrangement for an inkjet printhead, the nozzle arrangement comprising:

a substrate assembly defining an ink inlet and a static wall surrounding the ink inlet;

a roof structure defining a movable wall arranged to telescopically engage said static wall, the roof structure further defining an ink ejection port in fluid communication with said ink inlet; and

a pair of actuator assemblies mounted to the substrate assembly and the roof structure for substantially rectilinear movement of the roof structure toward the substrate assembly to eject ink through the ink ejection port.

2. A nozzle arrangement as claimed in claim 1 , comprising a quartet of actuator assemblies with two pairs of actuator assemblies being orthogonally arranged with respect to each other.

3. A nozzle arrangement as claimed in claim 1 , comprising one pair of actuator assemblies.

4. A nozzle arrangement as claimed in claim 1 , wherein said movable wall surrounds said static wall.

5. A nozzle arrangement as claimed in claim 1 , wherein the ink inlet channel is constricted in a region proximate the nozzle chamber.

6. A nozzle arrangement as claimed in claim 1 , wherein each actuator assembly is a thermal bend actuator assembly.

7. A nozzle arrangement as claimed in claim 6 , wherein the substrate assembly comprises:

a silicon wafer substrate;

an electrical drive circuitry layer positioned on the silicon wafer substrate and electrically coupled to the thermal bend actuator assemblies; and

an ink passivation layer positioned on the electrical drive circuitry layer from which the static wall extends.

Assignments (3)
CHANGE OF NAME Recorded Jun 25, 2014
From: ZAMTEC LIMITED
To: MEMJET TECHNOLOGY LIMITED
Reel/Frame 033244/0276 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 10, 2012
From: SILVERBROOK RESEARCH PTY. LIMITED AND CLAMATE PTY LIMITED
To: ZAMTEC LIMITED
Reel/Frame 028522/0610 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 4, 2009
From: SILVERBROOK, KIA
To: SILVERBROOK RESEARCH PTY LTD
Reel/Frame 022784/0960 →