Semiconductor device and manufacturing method of the same
A semiconductor device includes a wiring board, a semiconductor element mounted on the wiring board, a sealing resin configured to cover the semiconductor element, a ground electrode having an end connected to a wiring layer of the wiring board and an exposing part exposed at a surface of the sealing resin, and a shielding member configured to cover the sealing resin and be connected to the ground electrode.
1. A semiconductor device, comprising:
a wiring board having a wiring layer on an upper surface;
a semiconductor element mounted on the wiring board;
a sealing resin configured to cover the semiconductor element;
a ground electrode, which is covered with the sealing resin, having an end connected to the wiring layer on the upper surface of the wiring board at a portion covered with the sealing resin, and having another end as an exposed part which is exposed at a side surface of the sealing resin; and
a shielding member configured to cover the sealing resin and be connected to the exposed part of the ground electrode.
2. The semiconductor device as clamed in claim 1 , wherein the shielding member and the exposed part of the ground electrode are connected to each other by solder or a conductive adhesive.
3. The semiconductor device as clamed in claim 1 , wherein the ground electrode is a bonding wire extending from the wiring board to an upper side, and
the ground electrode is bent in an extending direction opposite to a direction of a side where the semiconductor element is provided so that another end of the ground electrode as the exposed part comes in contact with the shielding member.
4. The semiconductor device as clamed in claim 1 , wherein the ground electrode is a metal plate extending from the wiring board in a substantially vertical direction, and
the ground electrode is bent in an extending direction opposite to a direction to a side where the semiconductor element is provided and in a substantially horizontal direction, so that another end of the ground electrode as the exposed part comes in contact with the shielding member.
5. The semiconductor device as clamed in claim 1 , wherein the ground electrode is a bonding wire provided on the upper surface of the wiring board, and
a side surface of the ground electrode is exposed at the side surface of the sealing resin and comes in contact with the shielding member.
6. A semiconductor device, comprising:
a wiring board having a wiring layer on an upper surface;
a semiconductor element mounted on the wiring board;
a sealing resin configured to cover the semiconductor element; and
a ground electrode, which is covered with the sealing resin, having an end connected to the wiring layer on the upper surface of the wiring board at a portion covered with the sealing resin, and having another end as an exposed part which is exposed at a side surface of the sealing resin.