Flexible printed circuit board, method of fabricating the flexible printed circuit board, and display device having the flexible printed circuit board
Provided are a flexible printed circuit board (PCB), which can contribute to the reduction of damage to wiring layers and wiring defects regardless of a decrease in the width of wiring layers and can thus contribute to the miniaturization of various products, a method of fabricating the flexible PCB, and a display device having the flexible PCB. The flexible PCB includes a base film, one or more first pad patterns formed on the base film, one or more second pad patterns formed on the base film and connected to the one or more first pad patterns, a cover film formed on the one or more first pad patterns and the base film and exposing the one or more second patterns, and a plurality of expanded portions corresponding to the boundaries between the one or more first pad patterns and the one or more second pad patterns and having a greater width than the one or more first pad patterns and the one or more second pad patterns.
1. A flexible printed circuit board (PCB) comprising:
a base film;
one or more first pad patterns formed on the base film;
one or more second pad patterns formed on the base film and connected to the one or more first pad patterns;
a cover film formed on the one or more first pad patterns and the base film and exposing the one or more second patterns; and
a plurality of expanded portions corresponding to the boundaries between the one or more first pad patterns and the one or more second pad patterns and having a greater width than the one or more first pad patterns and the one or more second pad patterns, wherein the cover film overlaps a first portion of the plurality of expanded portions and does not overlap a second portion of the plurality of expanded portions.
2. The flexible PCB of claim 1 , wherein each of the one or more second pad patterns is formed as one of a double layer or a triple layer including a plating layer comprising at least one of gold and silver.
3. The flexible PCB of claim 1 , wherein each of the one or more first pad patterns comprises copper.
4. The flexible PCB of claim 3 , wherein each of the one or more second pad patterns includes a lower layer comprising copper, a middle layer comprising silver, and an upper layer comprising gold.
5. The flexible PCB of claim 1 , wherein the first portion of the plurality of expanded portions which is overlapped by the cover film is formed of a same material as the one or more first pad patterns and wherein the second portion of the plurality of expanded portions which is not overlapped by the cover film is formed of a same material as the one or more second pad patterns.
6. The flexible PCB of claim 1 , wherein the plurality of expanded portions are arranged in a straight line.
7. The flexible PCB of claim 1 , wherein a distance between a pair of adjacent expanded portions is greater than a distance between a pair of adjacent second pad patterns.
8. The flexible PCB of claim 7 , wherein the expanded portions are arranged in zigzag pattern.
9. The flexible PCB of claim 1 , wherein a first portion of the plurality of expanded portions are connected to the one or more first pad patterns and a second portion of the plurality of expanded portions are connected to the one or more second pad patterns.