LED with remote phosphor layer and reflective submount
View Patent ↗A light emitting device comprises a flip-chip light emitting diode (LED) die mounted on a submount. The top surface of the submount has a reflective layer. Over the LED die is molded a hemispherical first transparent layer. A low index of refraction layer is then provided over the first transparent layer to provide TIR of phosphor light. A hemispherical phosphor layer is then provided over the low index layer. A lens is then molded over the phosphor layer. The reflection achieved by the reflective submount layer, combined with the TIR at the interface of the high index phosphor layer and the underlying low index layer, greatly improves the efficiency of the lamp. Other material may be used. The low index layer may be an air gap or a molded layer. Instead of a low index layer, a distributed Bragg reflector may be sputtered over the first transparent layer.
1. A light emitting device comprising:
a flip-chip light emitting diode (LED) die on a submount;
a reflective layer, having a reflectivity of at least 90% for visible wavelengths, formed on a top surface of the submount;
a transparent substantially hemispherical first layer encapsulating the LED die, the first layer having a first index of refraction;
a substantially hemispherical second layer surrounding the first layer the second layer comprising a sol-gel that has been dried to form a porous layer so as to have a second index of refraction lower than the first index of refraction; and
a substantially hemispherical phosphor layer formed over the second layer, the second layer having characteristics that cause the second layer to reflect light from the phosphor layer at least when the light is greater than a certain angle with respect to the second layer,
wherein the reflective layer on the top surface of the submount extends at least below a portion of the phosphor layer.
2. The device of claim 1 wherein the phosphor layer has a third index of refraction greater than the first index of refraction.
3. The device of claim 1 wherein the phosphor layer comprises phosphor powder infused in silicone.
4. The device of claim 1 further comprising a transparent third layer surrounding the phosphor layer.
5. The device of claim 1 wherein the LED die emits blue light and the phosphor layer has a characteristic that converts a portion of the blue light to light that, when combined with the blue light, creates white light.
6. A method for forming a light emitting device comprising:
providing a flip-chip light emitting diode (LED) die on a submount;
forming a reflective layer, having a reflectivity of at least 90% for visible wavelengths, on a top surface of the submount;
molding a transparent substantially hemispherical first layer over and encapsulating the LED die, the first layer having a first index of refraction;
forming a substantially hemispherical second layer surrounding the first layer, the second layer comprising a sol-gel that has been dried to form a porous layer so as to have a second index of refraction lower than the first index of refraction; and
molding a substantially hemispherical phosphor layer over the second layer, the second layer having characteristics that cause the second layer to reflect light from the phosphor layer at least when the light is greater than a certain angle with respect to the second layer,
wherein the reflective layer on the top surface of the submount extends at least below a portion of the phosphor layer.
7. The method of claim 6 wherein forming the substantially hemispherical second layer surrounding the first layer comprises molding the sol-gel over the first layer and drying the sol-gel to create the second layer having the second index of refraction less than the index of refraction of the phosphor layer.
8. The method of claim 1 wherein molding a substantially hemispherical phosphor layer comprises molding a layer having phosphor powder infused in silicone.
9. The method of claim 1 further comprising molding a transparent third layer over the phosphor layer.