Electronic device
View Patent ↗According to one embodiment, an electronic device includes, a conductive housing, a substrate, a flexible substrate, a reinforcing element, and a conductor. The substrate is configured to be housed in the housing and is mounted with an electronic component. The flexible substrate includes a conductive signal layer stacked on a flexible insulating base material and electrically connected to the substrate, a cover layer covering the signal layer, a first surface mounted with the substrate, and a second surface on the reverse side of the first surface, having a portion where the signal layer is partially exposed. The reinforcing element is provided on the second surface to reinforce the flexible substrate and has an opening corresponding to the portion where the signal layer is partially exposed. The conductor is inserted from the opening of the reinforcing element and connects the signal layer to the housing.
1. An electronic device comprising:
a conductive housing;
a substrate housed in the housing and mounted with an electronic component;
a flexible substrate formed of a conductive signal layer stacked on a flexible insulating base material and covered with an insulating cover layer, the flexible substrate comprising
a first surface provided with a connector to connect to the substrate, and
a second surface on a reverse side of the first surface, the second surface comprising a portion where the signal layer is partially exposed at a position corresponding to where a pad of the connector is provided on the first surface;
a reinforcing element on the second surface to reinforce the flexible substrate, the reinforcing element comprising an opening corresponding to the portion where the signal layer is partially exposed and where the pad of the connector is provided on the first surface; and
a conductive gasket at the opening of the reinforcing element and in contact with the signal layer exposed at the portion of the second surface to connect the signal layer to the housing.
2. The electronic device of claim 1 , wherein the conductive gasket comprises a sponge and a conductive material covering the sponge.
3. The electronic device of claim 1 , wherein the conductive gasket comprises a surface-mountable on-board connector.
4. An electronic device comprising:
a conductive housing;
a substrate housed in the housing and mounted with an electronic component;
a flexible substrate formed of a conductive signal layer stacked on a flexible insulating base material and covered with an insulating cover layer, the flexible substrate comprising
a first surface provided with a connector to connect to the substrate, and
a second surface on a reverse side of the first surface, the second surface comprising a portion where the signal layer is partially exposed at a position corresponding to where the connector is provided on the first surface;
a reinforcing element on the second surface to reinforce the flexible substrate, the reinforcing element comprising an opening corresponding to the portion where the signal layer is partially exposed and where the connector is provided on the first surface; and
a conductive gasket at the opening of the reinforcing element and in contact with the signal layer exposed at the portion of the second surface to connect the signal layer to the housing, wherein
the conductive gasket is in contact with the signal layer exposed at the portion of the second surface via a conductive ground material.
5. The electronic device of claim 4 , wherein the conductive gasket comprises a sponge and a conductive material covering the sponge.
6. The electronic device of claim 4 , wherein the conductive gasket comprises a surface-mountable on-board connector.