Methods for interconnecting bonding pads between components
The present invention discloses methods and apparatuses for the separations of IC fabrication and assembling of separated IC components to form complete IC structures. In an embodiment, the present fabrication separation of an IC structure into multiple discrete components can take advantages of dedicated IC fabrication facilities and achieve more cost effective products. In another embodiment, the present chip assembling provides high density interconnect wires between bond pads, enabling cost-effective assembling of small chip components. In an aspect, the present process bonds multiple interconnect wires to bond pads with electrical linkages between the bond pads and then subsequently separates the adjacent bond pads.
1. A method for interconnecting bond pads between integrated components, the method comprising:
applying an electrically conductive adhesive line on multiple bond pads along a direction of the multiple bond pads of an integrated component;
placing multiple interconnect wires on the electrically conductive adhesive line on corresponding bond pads of a integrated component;
bonding the multiple interconnect wires to the bond pads, the bonding process providing electrical linkage between adjacent bond pads; and
electrically separating the electrically conductive line between the adjacent bond pads.
2. A method as in claim 1 further comprising positioning the integrated component in the vicinity of another integrated component an at least partially stacked configuration.
3. A method as in claim 1 further comprising
positioning the integrated component in the vicinity of another integrated component an at least partially coplanar configuration.
4. A method as in claim 1 further comprising forming a beveled slope of the integrated component.
5. A method as in claim 1 wherein placing the multiple interconnect wires comprises printing the multiple interconnect wires.
6. A method as in claim 1 wherein placing the multiple interconnect wires comprises simultaneously printing the multiple interconnect wires.
7. A method as in claim 1 wherein bonding the multiple interconnect wires to the bond pads comprises one of laser welding and applying a conductive adhesive.
8. A method as in claim 1 wherein electrically separating the adjacent bond pads comprises laser ablating between the adjacent bond pads.
9. A method for interconnecting bond pads between integrated components, the method comprising:
applying an electrically conductive adhesive line on multiple bond pads along a direction of the multiple bond pads of an integrated component;
placing multiple interconnect wires on the electrically conductive adhesive line corresponding to the bond pads;
bonding the multiple interconnect wires to the bond pads; and
laser ablating between the adjacent bond pads for separating the electrically conductive line.
10. A method as in claim 9 wherein applying a conductive adhesive line comprises printing a conductive adhesive line.
11. A method as in claim 9 further comprising curing the conductive adhesive line.
12. A method as in claim 9 further comprising pushing the interconnect wires onto the bond pads.
13. A method as in claim 9 further comprising forming a beveled slope of the integrated component.
14. A method as in claim 9 wherein placing the multiple interconnect wires comprises printing the multiple interconnect wires.
15. A method as in claim 9 wherein placing the multiple interconnect wires comprises simultaneously printing the multiple interconnect wires.
16. A method as in claim 9 further comprising positioning the integrated component in the vicinity of another integrated component an at least partially stacked configuration.
17. A method as in claim 9 further comprising positioning the integrated component in the vicinity of another integrated component an at least partially coplanar configuration.
18. A method as in claim 17 further comprising applying a conductive adhesive line along the bond pads of the another integrated component.
19. A method as in claim 17 further comprising bonding the multiple interconnect wires to the bond pads of the another component.
20. A method as in claim 17 further comprising laser ablating between the adjacent bond pads of the another component.
21. A method for interconnecting bond pads between integrated components, the method comprising:
applying an electrically conductive adhesive line on multiple bond pads along a direction of the multiple bond pads of an integrated component;
placing multiple interconnect wires on the electrically conductive adhesive line on corresponding bond pads;
laser welding the multiple interconnect wires to the bond pads; and
laser ablating between the adjacent bond pads.
22. A method as in claim 21 wherein laser welding comprises running a laser along the direction of the adjacent bond pads.
23. A method as in claim 21 wherein a same laser is used for welding and ablating.
24. A method as in claim 21 further comprising pushing the interconnect wires onto the bond pads.
25. A method as in claim 21 further comprising forming a beveled slope of the integrated component.
26. A method as in claim 21 wherein placing the multiple interconnect wires comprises printing the multiple interconnect wires.
27. A method as in claim 21 wherein placing the multiple interconnect wires comprises simultaneously printing the multiple interconnect wires.
28. A method as in claim 21 further comprising
positioning the integrated component in the vicinity of another integrated component in at least partially stacked configuration.