Processes and structures for IC fabrication
View Patent ↗The present invention discloses methods and apparatuses for the separations of IC fabrication and assembling of separated IC components to form complete IC structures. In an embodiment, the present fabrication separation of an IC structure into multiple discrete components can take advantages of dedicated IC fabrication facilities and achieve more cost effective products. In another embodiment, the present chip assembling provides high density interconnect wires between bond pads, enabling cost-effective assembling of small chip components. In an aspect, the present process forms interconnect wires on a thermal decomposable adhesive, and after positioning the wires at proper bond pad locations, releases the interconnect wires onto the bond pads.
1. A method for interconnecting bond pads between integrated components, the method comprising:
forming interconnect wires on a thermally decomposable adhesive on a printhead substrate;
positioning the printhead so that at least an interconnect wire of the interconnect wires is located over a desired location of bond pads;
releasing the at least an interconnect wire, the at least an interconnect wire falling on the corresponding bond pads.
2. A method as in claim 1 further comprising
forming a beveled slope of one of the integrated components.
3. A method as in claim 1 further comprising
pushing the at least an interconnect wire onto the bond pads.
4. A method as in claim 1 further comprising
laser welding the at least an interconnect wire to the bond pads.
5. A method as in claim 1 further comprising
applying a conductive adhesive on the bond pads before releasing the at least an interconnect wire.
6. A method as in claim 1 wherein the integrated components are positioned in an at least partially stacked configuration.
7. A method as in claim 1 wherein the integrated components are positioned in an at least partially coplanar configuration.
8. A method as in claim 1 wherein the printhead simultaneously releases multiple interconnect wires over corresponding bond pads.
9. A method for forming interconnect wires on a printhead, the method comprising:
placing interconnect wires on a thermally decomposable adhesive on a printhead substrate;
laser cutting the interconnect wires to correct lengths.
10. A method as in claim 9 wherein the interconnect wires are separated by a same distance as the separation of adjacent bond pads.
11. A method as in claim 9 wherein multiple interconnect wires are cut to a same length for simultaneously printing on multiple bond pads.
12. A method as in claim 9 further comprising
coating a layer of thermally decomposable adhesive on the printhead substrate.
13. A method as in claim 9 wherein the thermally decomposable adhesive is releasable by at least one of heat and light.
14. A method for forming interconnect wires on a printhead, the method comprising:
depositing a conductive layer on a thermally decomposable adhesive on a printhead substrate;
patterning the conductive layer to form interconnect wires with correct lengths.
15. A method as in claim 14 wherein patterning the conductive layer comprises a photolithography process.
16. A method as in claim 14 wherein the interconnect wires are separated by a same distance as the separation of adjacent bond pads.
17. A method as in claim 14 wherein multiple interconnect wires are patterned to a same length for simultaneously printing on multiple bond pads.
18. A method as in claim 14 further comprising
coating a layer of thermally decomposable adhesive on the printhead substrate.
19. A method as in claim 14 wherein the thermally decomposable adhesive is releasable by at least one of heat and light.
20. A method for forming interconnect wires on a printhead, the method comprising:
extruding an interconnect wire on a thermally decomposable adhesive on a printhead substrate;
laser cutting a correct length of the interconnect wire, the interconnect wire falling on the thermal decomposable adhesive.
21. A method as in claim 20 wherein extruding the interconnect wire comprises a mechanical feeder.
22. A method as in claim 20 wherein extruding the interconnect wire comprises a wirebonder wire feeder mechanism.
23. A method as in claim 20 wherein the interconnect wires are separated by a same distance as the separation of adjacent bond pads.
24. A method as in claim 20 wherein multiple interconnect wires are cut to a same length for simultaneously printing on multiple bond pads.
25. A method as in claim 20 further comprising
coating a layer of thermally decomposable adhesive on the printhead substrate.
26. A method as in claim 20 wherein the thermally decomposable adhesive is releasable by at least one of heat and light.
27. A printhead for printing interconnect wires, comprising
a thermally decomposable adhesive on a printhead substrate;
a plurality of interconnect wires patterned to the correct lengths disposed on the thermally decomposable adhesive; and
a release mechanism for releasing the thermally decomposable adhesive.
28. A printhead as in claim 27 wherein the interconnect wires are separated by a same distance as the separation of adjacent bond pads.
29. A printhead as in claim 27 wherein multiple interconnect wires are cut to a same length for simultaneously printing on multiple bond pads.
30. A printhead as in claim 27 wherein the release mechanism comprises at least one of heat and light.
31. A printhead as in claim 27 wherein the interconnect wires are placed on the thermal decomposable adhesive and laser cut to the correct lengths.
32. A printhead as in claim 27 wherein the interconnect wires are patterned to the correct lengths from a deposited conductive layer on the thermal decomposable adhesive.