Processes and structures for IC fabrication
View Patent ↗The present invention discloses methods and apparatuses for the separations of IC fabrication and assembling of separated IC components to form complete IC structures. In an embodiment, the present fabrication separation of an IC structure into multiple discrete components can take advantages of dedicated IC fabrication facilities and achieve more cost effective products. In another embodiment, the present chip assembling provides high density interconnect wires between bond pads, enabling cost-effective assembling of small chip components. In an aspect, the present process provides multiple interconnect wires in the form of a ribbon between the bond pads, and then subsequently separates the ribbon into multiple individual interconnect wires.
1. A method for interconnecting bond pads between integrated components, the method comprising:
positioning a ribbon interconnect over a plurality of bond pads, the ribbon interconnect comprising a sheet of conductive material spanning across two or more adjacent bond pads of an integrated component, wherein the sheet of conductive material electrically connects the two or more adjacent bond pads;
separating, between the two or more adjacent bond pads, the ribbon interconnect into multiple interconnect wires, at least one interconnect wire disposed on a corresponding bond pad.
2. A method as in claim 1 wherein separating the ribbon interconnect comprises laser ablating the ribbon interconnect.
3. A method as in claim 1 wherein separating the ribbon interconnect separates the ribbon interconnect into multiple individual interconnect wires, each interconnect wire disposed on a corresponding bond pad.
4. A method as in claim 1 further comprising
forming a beveled slope of the integrated component.
5. A method as in claim 1 wherein positioning the ribbon interconnect comprises printing the ribbon interconnect.
6. A method as in claim 1 further comprising
bonding the ribbon interconnect to the corresponding bond pads.
7. A method as in claim 1 wherein bonding the ribbon interconnect to the bond pads comprises one of laser welding, ultrasonic welding, and applying a conductive adhesive.
8. A method as in claim 1 further comprising
applying a conductive adhesive line along the bond pads before positioning the ribbon interconnect.
9. A method as in claim 1 further comprising
welding the ribbon interconnect after positioning the ribbon interconnect on the bond pads.
10. A method as in claim 1 wherein a same laser is used for welding and separating.
11. A method as in claim 1 further comprising
positioning the integrated component in the vicinity of another integrated component in an at least partially stacked configuration.
12. A method as in claim 1 further comprising
positioning the integrated component in the vicinity of another integrated component an at least partially coplanar configuration.
13. A method as in claim 11 further comprising
applying a conductive adhesive line along the bond pads of the another integrated component.
14. A method as in claim 11 further comprising
welding the ribbon interconnect to the bond pads of the another component.
15. A method for interconnecting bond pads between integrated components, the method comprising:
positioning a conductive ribbon interconnect over a plurality of bond pads, wherein the ribbon interconnect is conductively connected across two or more adjacent bond pads of an integrated component;
laser welding the ribbon interconnect to the two or more adjacent bond pads; and
laser ablating the ribbon interconnect between the two or more adjacent bond pads to separate into multiple interconnect wires, at least one interconnect wire disposed on a corresponding bond pad.
16. A method as in claim 15 wherein laser welding runs continuously along the adjacent bond pads.
17. A method as in claim 15 wherein a same laser is used for welding and ablating.
18. A method as in claim 15 further comprising
pushing the ribbon interconnect onto the bond pads.
19. A method as in claim 15 wherein separating the ribbon interconnect separates the ribbon interconnect into multiple individual interconnect wires, each interconnect wire disposed on a corresponding bond pad.
20. A method as in claim 15 further comprising
forming a beveled slope of the integrated component.
21. A method as in claim 15 wherein positioning the ribbon interconnect comprises printing the ribbon interconnect.
22. A method as in claim 15 further comprising
positioning the integrated component in the vicinity of another integrated component in an at least partially stacked configuration.
23. A method as in claim 15 further comprising
positioning the integrated component in the vicinity of another integrated component in an at least partially coplanar configuration.
24. A method for interconnecting bond pads between integrated components, the method comprising:
positioning a ribbon interconnect for conductively connecting a plurality of bond pads of an integrated component;
separating the ribbon interconnect between the plurality of bond pads into multiple interconnect wires, at least one interconnect wire disposed on a corresponding bond pad.
25. A method as in claim 24 wherein separating the ribbon interconnect comprises laser ablating the ribbon interconnect.
26. A method as in claim 24 wherein separating the ribbon interconnect separates the ribbon interconnect into multiple individual interconnect wires, each interconnect wire disposed on a corresponding bond pad.
27. A method as in claim 24 further comprising
forming a beveled slope of the integrated component.
28. A method as in claim 24 wherein positioning the ribbon interconnect comprises printing the ribbon interconnect.
29. A method as in claim 24 further comprising
bonding the ribbon interconnect to the corresponding bond pads.
30. A method as in claim 24 wherein bonding the ribbon interconnect to the bond pads comprises one of laser welding, ultrasonic welding, and applying a conductive adhesive.