Processes and structures for IC fabrication
The present invention discloses methods and apparatuses for the separations of IC fabrication and assembling of separated IC components to form complete IC structures. In an embodiment, the present fabrication separation of an IC structure into multiple discrete components can take advantages of dedicated IC fabrication facilities and achieve more cost effective products. In another embodiment, the present chip assembling provides high density interconnect wires between bond pads, enabling cost-effective assembling of small chip components. In an aspect, the present process coats the component surfaces to facilitate the bonding of the bond pads. In another aspect, the present process coats the bond pads with shelled capsules to facilitate the bonding of the bond pads.
1. A method for interconnecting bond pads between integrated components, the method comprising:
coating a bond pad surface of an integrated component with capsules of a liquid metal, the capsules having a polymer shell;
contacting the surfaces of the two integrated components so that the bond pads of the two integrated components are aligned, and
squeezing the two integrated components to break the capsules, allowing the liquid metal to make electrical contact between the two surfaces of the bond pads.
2. A method as in claim 1 wherein the capsules are formed from an emulsion process.
3. A method as in claim 1 wherein the capsules are formed by self-assembly of polymer chain as surfactant.
4. A method as in claim 1 wherein the polymer has an affinity with the surface of the bond pad.
5. A method as in claim 1 wherein the surface of the integrated components is treated so that the liquid metal will not wet or stick to it.
6. A method as in claim 1 further comprising curing the contact.
7. A method as in claim 1 wherein the liquid metal is mixed with fine particles which alloy to form a higher melting point metal.