Semiconductor laser device
View Patent ↗In a semiconductor laser device, a first lead has a mounting portion for mounting a semiconductor laser element on its top surface via a submount member, and a lead portion extending from the mounting portion. Given that a direction in which a primary beam is emitted from the laser element is defined as a forward direction, and that a direction vertical to the forward direction and parallel to the top surface of the mounting portion is defined as a lateral direction, the first lead has, in one region of a side face of the mounting portion, a lateral reference surface which is parallel to a side face of the semiconductor laser element and flat. In the one region of the side face of the mounting portion, a recess portion is formed adjacent to the lateral reference surface.
1. A semiconductor laser device comprising:
a semiconductor laser element;
a first lead having a mounting portion for mounting the semiconductor laser element on a top surface of the mounting portion via a submount member, and a lead portion extending from the mounting portion;
a second lead extending along the lead portion of the first lead; and
a holding portion made of an insulative material for integrally holding the first lead and the second lead, wherein
given that a direction in which a primary beam is emitted from the semiconductor laser element is defined as a forward direction, a direction vertical to the forward direction and parallel to the top surface of the mounting portion is defined as a lateral direction, and that a direction vertical to the top surface of the mounting portion is defined as an up/down direction,
the first lead has, in one region of a side face of the mounting portion, a lateral reference surface which is parallel to a side face of the semiconductor laser element and which is flat, and in the one region of the side face of the mounting portion, a recess portion is provided adjacent to the lateral reference surface, and wherein
a cut-and-raised portion is formed by cutting and upwardly raising a region of the mounting portion other than a region where the semiconductor laser element is mounted, and
spaces formed in the mounting portion by the formation of the cut-and-raised portion are filled with the material of the holding portion; the mounting portion has a part of a protrusive shape at its rear side, an upper surface of the semiconductor laser element and the part having the protrusive shape are connected to each other with a wire.
2. The semiconductor laser device as claimed in claim 1 , wherein
a bottom surface of the mounting portion is exposed from the holding portion and has an up/down reference surface which is parallel to a bottom surface of the semiconductor laser element and which is flat, and
given that a direction running from the semiconductor laser element toward the mounting portion is defined as a downward direction, a lower surface of the holding portion and the up/down reference surface are coplanar with each other.
3. The semiconductor laser device as claimed in claim 2 , wherein
a lower surface of the semiconductor laser device consists of the lower surface of the holding portion and the up/down reference surface of the first lead, and
the lower surface of the holding portion is positioned rearward of the up/down reference surface.
4. The semiconductor laser device as claimed in claim 1 , wherein
the top surface of the mounting portion of the first lead, a bottom surface of the lead portion of the first lead, and a bottom surface of the second lead are coplanar with one another.
5. The semiconductor laser device as claimed in claim 1 , wherein
the mounting portion of the first lead, the lead portion of the first lead, and the second lead are equal in up/down direction thickness to one another.
6. The semiconductor laser device as claimed in claim 1 , wherein
the holding portion has a frame portion around the semiconductor laser element,
a window portion for emitting a primary beam from the semiconductor laser element is formed in the frame portion, and
given that an inside of the frame portion of the holding portion is defined as a side on which the semiconductor laser element is mounted on the mounting portion via the submount member, a tapered portion having a surface inclined with respect to the top surface of the mounting portion is provided in a location in the inside of the frame portion of the holding portion.
7. The semiconductor laser device as claimed in claim 6 , wherein
the tapered portion is located rearward of the semiconductor laser element.
8. The semiconductor laser device as claimed in claim 6 , wherein
an upper surface of the submount member and a top surface of the second lead positioned inside of the frame portion of the holding portion are connected to each other with a wire.
9. The semiconductor laser device as claimed in claim 1 , wherein
the first lead and the second lead extend through and beyond the holding portion,
a portion extending through the holding portion of the first lead has an up/down bent portion that is bent in an up/down direction, and
a portion extending through the holding portion of the second lead has a left/right bent portion that is bent in a left/right direction.