Integrated circuit packaging system with a leadframe having radial-segments and method of manufacture thereof

1. A method of manufacture of an integrated circuit packaging system comprising:

providing inwardly converging leadfingers having continuously decreasing widths along lengths thereof to inward ends thereof;

electrically connecting an integrated circuit device to the leadfingers only on portions of the continuously decreasing widths beyond a periphery of the integrated circuit device, with the integrated circuit device overlapping the inward ends of the leadfingers; and

encapsulating the integrated circuit device and the leadfingers with an encapsulation.

2. The method as claimed in claim 1 further comprising:

attaching a further integrated circuit device to a bottom side of the leadfingers; and wherein:

encapsulating with the encapsulation includes only partially encapsulating the further integrated circuit device leaving a surface exposed from the encapsulation.

3. The method as claimed in claim 1 wherein:

encapsulating the leadfingers includes only partially encapsulating the leadfingers leaving portions of constant widths of the lead finger exposed from an edge of the encapsulation.

4. The method as claimed in claim 1 further comprising:

creating solder-capture-trenches in the leadfinger on the continuously decreasing widths.

5. The method as claimed in claim 1 wherein:

providing the leadfingers includes providing the leadfingers having radial-segments.

6. A method of manufacture of an integrated circuit packaging system comprising:

providing a leadframe with leadfingers having pitches that vary from a large pitch adjacent the leadframe and having continuously decreasing widths along lengths of the leadfingers to the inward ends of the leadfingers; to a fine pitch at inward ends away from the leadframe;

electrically connecting an integrated circuit only on portions of the continuously decreasing widths device beyond a periphery of the integrated circuit device with the integrated circuit device overlapping the inward ends of the leadfingers;

attaching a further integrated circuit device to a bottom side of the lead fingers with electrical contacts;

encapsulating the integrated circuit device and the leadfingers with an encapsulation; and

removing a portion of the leadframe adjacent to the leadfingers.

7. The method as claimed in claim 6 wherein:

encapsulating with the encapsulation includes only partially encapsulating the further integrated circuit device leaving a package surface exposed from the encapsulation.

8. The method as claimed in claim 6 wherein:

encapsulating the leadfingers includes only partially encapsulating the leadfingers leaving portions of constant widths exposed from an edge of the encapsulation; and

further comprising:

bending portions of the leadfingers exposed from the edge of the encapsulation.

9. The method as claimed in claim 6 further comprising:

creating solder-capture-trenches in the leadfingers bordering the electrical contacts.

10. The method as claimed in claim 6 wherein:

providing the leadframe includes providing the leadframe having radial-segments at the inward ends; and

attaching the further integrated circuit device includes attaching the electrical contacts to the radial segments of the leadfingers.

11. An integrated circuit packaging system comprising:

inwardly converging leadfingers having continuously decreasing widths along lengths thereof to inward ends thereof;

an integrated circuit device electrically connected on the leadfingers only on portions of the continuously decreasing widths beyond a periphery of the integrated circuit device with the integrated circuit device overlapping the inward ends of the leadfingers; and

an encapsulation over the integrated circuit device and the leadfingers.

12. The system as claimed in claim 11 further comprising:

a further integrated circuit device attached to a bottom side of the leadfingers: and wherein:

the encapsulation only partially encapsulates the further integrated circuit device leaving a surface exposed from the encapsulation.

13. The system as claimed in claim 11 wherein:

the encapsulation only partially encapsulates the leadfingers leaving portions of constant widths of the leadfinger exposed from an edge of the encapsulation.

14. The system as claimed in claim 11 wherein:

the leadfingers include solder-capture-trenches on the continuously decreasing widths.

15. The system as claimed in claim 11 wherein:

the leadfingers include radial-segments.

16. The system as claimed in claim 11 wherein:

the leadfingers have pitches that vary from a large pitch at outer ends of the leadfingers to a fine pitch at inward ends of the leadfingers; and

further comprising:

a further integrated circuit device attached to a bottom side of the leadfingers with electrical contacts.

17. The system as claimed in claim 16 wherein:

the encapsulation only partially encapsulates the further integrated circuit device leaving a package surface exposed from the encapsulation.

18. The system as claimed in claim 16 wherein:

the encapsulation only partially encapsulates the leadfingers leaving portions of constant widths exposed from an edge of the encapsulation; and

the leadfingers have bent portions exposed from the edge of the encapsulation.

19. The system as claimed in claim 16 wherein:

the leadfingers include solder-capture-trenches in the leadfingers bordering the electrical contacts.

20. The system as claimed in claim 16 wherein:

the leadfingers include radial-segments at the inward ends; and

the electrical contacts are attached to the radial-segments.