IP Library Granted Patent US 8,088,306
Granted Patent B2
US 8,088,306 · App. 12/488,771 · Granted Jan 3, 2012

Electroconductive thermoplastic resin composition and plastic article including the same

Assignee: Cheil Industries Inc.
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Quick Facts
Patent No.
US 8,088,306
App. No.
12/488,771
Granted
Jan 3, 2012
Kind
B2
Abstract

Disclosed herein are an electrically conductive thermoplastic resin composition and a plastic article including the same. The electrically conductive thermoplastic resin composition comprises about 80 to about 99.9 parts by weight of a thermoplastic resin, about 0.1 to about 10 parts by weight of carbon nanotubes, about 0.1 to about 10 parts by weight of an impact modifier, based on a total of about 100 parts by weight of the thermoplastic resin and the carbon nanotubes, and about 0.1 to about 10 parts by weight of conductive metal oxide, based on a total of about 100 parts by weight of the thermoplastic resin and the carbon nanotubes.

Claims (23)

1. An electrically conductive thermoplastic resin composition comprising:

about 80 to about 99.9 parts by weight of a thermoplastic resin;

about 0.1 to about 10 parts by weight of carbon nanotubes;

about 0.1 to about 10 parts by weight of an impact modifier, based on a total of about 100 parts by weight of the thermoplastic resin and the carbon nanotubes; and

about 0.1 to about 10 parts by weight of conductive metal oxide, based on a total of about 100 parts by weight of the thermoplastic resin and the carbon nanotubes, wherein the conductive metal oxide includes zinc oxide combined with a metal comprising aluminum, gallium, germanium, indium, tin, or a combination thereof.

2. The electrically conductive thermoplastic resin composition according to claim 1 , wherein the thermoplastic resin comprises polyacetal, acrylic resin, polycarbonate, styrenic resin, polyester, vinyl resin, polyphenylene ether, polyolefin, acrylonitrile-butadiene-styrene copolymer, polyarylate, polyamide, polyamide imide, polyarylsulfone, polyether imide, polyethersulfone, polyphenylene sulfide, polyvinylidene fluoride resin, polyimide, polyetherketone, polybenzoxazole, polyoxadiazole, polybenzothiazole, polybenzimidazole, polypyridine, polytriazole, polypyrrolidine, polydibenzofuran, polysulfone, polyurea, polyphosphazene, liquid crystal polymer resin, a copolymer thereof, or a combination thereof.

3. The electrically conductive thermoplastic resin composition according to claim 2 , wherein the thermoplastic resin includes a polycarbonate resin.

4. The electrically conductive thermoplastic resin composition according to claim 3 , wherein the polycarbonate resin includes an aromatic polycarbonate resin prepared by reacting phosgene, halogen formate or diester carbonate with a diphenol compound by represented by Formula 1 below:

wherein A is a single bond, C 1 -C 5 alkylene, C 1 -C 5 alkylidene, C 5 -C 6 cycloalkylidene, —S— or —SO 2 —; X is halogen; and n is 0, 1 or 2.

5. The electrically conductive thermoplastic resin composition according to claim 2 , wherein the thermoplastic resin includes a polycarbonate resin having a weight average molecular weight of about 15,000 to about 50,000 g/mol.

6. The electrically conductive thermoplastic resin composition according to claim 1 , wherein the carbon nanotubes are single-walled carbon nanotubes, double-walled nanotubes, multi-walled carbon nanotubes, or a combination thereof.

7. The electrically conductive thermoplastic resin composition according to claim 1 , wherein the carbon nanotubes have a diameter of about 1 to about 50 nm and a length of about 0.01 to about 10 μm.

8. The electrically conductive thermoplastic resin composition according to claim 1 , wherein the carbon nanotubes have an aspect ratio of about 100 to about 1,000.

9. The electrically conductive thermoplastic resin composition according to claim 1 , wherein the impact modifier comprises a core-shell graft copolymer, a silicone polymer, an olefin polymer, or a combination thereof.

10. The electrically conductive thermoplastic resin composition according to claim 9 , wherein the core-shell graft copolymer has a core-shell structure comprising methyl methacrylate, styrene, acrylonitrile, or a combination thereof grafted on a rubber core polymerized from C 4 -C 6 diene rubber monomer, acrylic rubber monomer, silicone rubber monomer, or a combination thereof.

11. The electrically conductive thermoplastic resin composition according to claim 9 , wherein the silicone polymer includes a monomer comprising hexamethyl cyclotrisiloxane, octamethyl cyclotetrasiloxane, decamethyl cyclopentasiloxane, dodecamethyl cyclohexasiloxane, trimethyl triphenyl cyclotrisiloxane, tetramethyl tetraphenyl cyclotetrasiloxane, octaphenyl cyclotetrasiloxane, or a combination thereof.

12. The electrically conductive thermoplastic resin composition according to claim 9 , wherein the olefin polymer includes a monomer comprising ethylene, propylene, isopropylene, butylene, isobutylene, or a combination thereof.

13. A plastic article prepared from the electrically conductive thermoplastic resin composition according to claim 1 .

14. A plastic article comprising:

a thermoplastic resin matrix;

carbon nanotubes dispersed in the thermoplastic resin matrix;

an impact modifier dispersed in the thermoplastic resin matrix; and

conductive metal oxide dispersed in the thermoplastic resin matrix, wherein the conductive metal oxide includes zinc oxide combined with a metal comprising aluminum, gallium, germanium, indium, tin, or a combination thereof.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 30, 2017
From: SAMSUNG SDI CO., LTD.
To: LOTTE ADVANCED MATERIALS CO., LTD.
Reel/Frame 042114/0895 →
MERGER Recorded Jul 14, 2016
From: CHEIL INDUSTRIES INC.
To: SAMSUNG SDI CO., LTD.
Reel/Frame 039360/0858 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 16, 2009
From: KIM, TAE KYUN; LEE, YOUNG SIL; CHANG, YOUNG KYU
To: CHEIL INDUSTRIES INC.
Reel/Frame 023239/0374 →
Priority Claims (1)
KR 10-2006-0132286 · Dec 22, 2006 · national
Continuity (2)
Continuation In Part PCTKR2006005856 · Dec 28, 2006
Related Publication 20090321687A1 · Dec 31, 2009