Applying chiplets to substrates
View Patent ↗A method of providing chiplets over a substrate including providing in sequence a substrate; coating an adhesive in a layer over the substrate; placing a plurality of first chiplets onto the adhesive layer in separated chiplet location(s) to adhere the first chiplets to the adhesive layer, wherein one or more of the first chiplets do not adhere to the adhesive layer, so that first chiplet(s) are adhered to the adhesive layer in adhered chiplet location(s) and first chiplet(s) are not adhered in non-adhered chiplet location(s); locally processing the adhesive layer in the non-adhered chiplet location(s) to condition the adhesive layer in the non-adhered locations to receive second chiplets; placing second chiplet(s) onto the adhesive layer in the conditioned non-adhered chiplet location(s) to adhere the second chiplets in the adhesive layer in the non-adhered locations; and curing the adhesive.
1. A method of providing chiplets over a substrate comprising providing in sequence:
(a) providing a substrate;
(b) coating an adhesive in a layer over the substrate;
(c) placing a plurality of first chiplets onto the adhesive layer in separated chiplet locations to adhere the first chiplets to the adhesive layer, wherein one or more of the first chiplets do not adhere to the adhesive layer, so that first chiplet(s) are adhered to the adhesive layer in adhered chiplet location(s) and first chiplet(s) are not adhered or are improperly adhered in non-adhered chiplet location(s);
(d) locally processing the adhesive layer in the non-adhered chiplet location(s) to condition the adhesive layer in the non-adhered locations to receive second chiplets by forming local additional adhesive layer(s) that buries the first chiplet(s) improperly adhered in the non-adhered chiplet location(s);
(e) placing second chiplet(s) onto the adhesive layer in the local additional adhesive layer(s) to adhere the second chiplets in the adhesive layer in the non-adhered locations; and
(f) curing the adhesive.
2. The method of claim 1 , wherein during the coating step, particle(s) contaminate the adhesive layer in the non-adhered chiplet location(s).
3. The method of claim 1 , wherein the locally processing step includes depositing additional adhesive over the adhesive layer in the non-adhered chiplet location(s).
4. The method of claim 3 , wherein the additional adhesive dislodges relocates, or buries particle(s) contaminating the adhesive layer in the non-adhered chiplet location(s).
5. The method of claim 3 , wherein the locally processing step includes planarizing the adhesive layer surface in the non-adhered chiplet location(s) with the additional adhesive.
6. The method of claim 3 , wherein an inkjet device or micro-dispensing device is used to deposit the additional adhesive.
7. The method of claim 2 , including using a gas micro jet to dislodge or remove the particle(s) from the non-adhered chiplet location(s).
8. The method of claim 2 , including using gas micro-suctioning to dislodge or remove the particle(s) from the non-adhered chiplet location(s).
9. The method of claim 1 , including applying a stamp to the non-adhered chiplet area.
10. The method of claim 9 , wherein during the coating step, particle(s) contaminate the adhesive layer in the non-adhered chiplet location(s), and wherein applying the stamp to the non-adhered chip let area forces the particle(s) at least partially into the adhesive layer on the substrate.