Method and structure of monolithetically integrated micromachined microphone using IC foundry-compatiable processes
A monolithically integrated MEMS and CMOS substrates provided by an IC-foundry compatible process. The CMOS substrate is completed first using standard IC processes. A diaphragm with stress relief corrugated structure is then fabricated on top of the CMOS. Air vent holes are then etched in the CMOS substrate. Finally, the microphone device is encapsulated by a thick insulating layer at the wafer level. The monolithically integrated microphone that adopts IC foundry-compatible processes yields the highest performance, smallest form factor, and lowest cost. Using this architecture and fabrication flow, it is feasible and cost-effective to make an array of Silicon microphones for noise cancellation, beam forming, better directionality and fidelity.
1. A microphone device comprising:
a substrate having a surface region;
a CMOS integrated circuit device layer overlying the surface region of the substrate;
a diaphragm device having a plurality of surface regions overlying the CMOS integrated circuit device layer, wherein the plurality of surface regions comprises at least one surface region disposed within a center region of the diaphragm and two or more surface regions disposed radially around the center region of the diaphragm, the plurality of surface regions being coupled to the CMOS integrated circuit device layer; and
at least one or more spring devices spatially disposed within a vicinity of the plurality of surface regions of the diaphragm device, each of the spring devices being operably coupled to at least one of the plurality of surface regions of the diaphragm device.
2. The device of claim 1 wherein each of the one or more spring devices comprises one or more folded spring devices having a horizontal compliance and a vertical compliance.
3. The device of claim 1 wherein the one or more spring devices being integrally formed within the plurality of surface regions of the diaphragm device.
4. The device of claim 1 wherein the diaphragm device is characterized by a thickness of about one micron and less.
5. The device of claim 1 wherein the diaphragm device is made of a semiconductor material, a metal material, or a dielectric material or any combination of these.
6. The device of claim 1 wherein the plurality of surface regions comprises an array being defined by N and M, where N and M are integers greater than 2.
7. The device of claim 1 further comprising one or more lower electrodes operably coupled to one or more of the surface regions, the one or more lower electrodes overlying the CMOS integrated circuit device layer, the one or more lower electrodes underlying the diaphragm device.
8. The device of claim 7 further comprising one or more upper electrodes operably coupled to the CMOS integrated circuit device layer, the one or more upper electrodes overlying the diaphragm device to form one or more variable capacitor structures.
9. The device of claim 7 wherein each of the one or more lower electrodes comprises one or more metal regions coupled to one or more of CMOS integrated circuits in the CMOS integrated circuit device layer.
10. The device of claim 7 wherein each of the one or more lower electrodes comprises one or more metal regions overlying an upper dielectric layer provided on the CMOS integrated circuit device layer.
11. The device of claim 7 further comprising one or more vent regions provided adjacent to one or more of the lower electrodes, the one or more of the vent regions extending to a cavity region within a portion of the substrate.
12. The device of claim 1 further comprising a housing member provided overlying the diaphragm device to form an air cavity region between the housing member and the diaphragm device, the housing member comprising one or more air openings to allow air to move between the air cavity and a region outside of the housing member.
13. A microphone device comprising:
a substrate having a surface region;
a CMOS integrated circuit device layer overlying the surface region of the substrate;
a diaphragm device having a plurality of surface regions overlying the CMOS integrated circuit device layer, wherein the plurality of surface regions comprises at least one surface region disposed within a center region of the diaphragm and two or more surface regions disposed radially around the center region of the diaphragm, the plurality of surface regions being coupled to the substrate;
at least one or more folded spring devices spatially disposed within a vicinity of the plurality of surface regions of the diaphragm device, each of the folded spring devices being operably coupled to at least one of the plurality of surface regions of the diaphragm device;
two or more electrode devices operably coupled to each of the plurality of surface regions; and
at least one air channel formed between the two or more electrode devices.
14. The device of claim 13 wherein each of the one or more folded spring devices comprises one or more folded spring devices having a horizontal compliance and a vertical compliance.
15. The device of claim 13 wherein the one or more folded spring devices being integrally formed within the plurality of surface regions of the diaphragm device.
16. The device of claim 13 wherein the diaphragm device is characterized by a thickness of about one micron and less.
17. The device of claim 13 wherein the diaphragm device is made of a semiconductor material, a metal material, or a dielectric material, or any combination of these.
18. The device of claim 13 wherein the plurality of surface regions comprises an array being defined by N and M, where N and M are integers greater than 2.
19. The device of claim 13 further comprising one or more air vent regions provided within a vicinity of the two or more electrode devices.
20. The device of claim 13 further comprising a housing member provided overlying the diaphragm device to form an air cavity region between the housing member and the diaphragm device, the housing member comprising one or more air openings to allow air to move between the air cavity and a region outside of the housing member.
21. The device of claim 13 further comprising:
a housing member provided overlying the diaphragm device to form an air cavity region between the housing member and the diaphragm device, the housing member comprising one or more air openings to allow air to move between the air cavity and a region outside of the housing member; and
one or more air vent regions provided within a vicinity of the two or more electrode devices, the one or more vent regions being in fluid communication with the air cavity.