IP Library Granted Patent US 8,679,727
Granted Patent B2
US 8,679,727 · App. 12/490,934 · Granted Mar 25, 2014

Developing method for immersion lithography, solvent used for the developing method and electronic device using the developing method

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,679,727
App. No.
12/490,934
Granted
Mar 25, 2014
Kind
B2
Abstract

A developing method for immersion lithography is provided, realizing a process that is simple and low-cost and enables high repellency sufficient to allow high-speed scanning. The developing method for immersion lithography improved by inexpensive material without introducing any new facility, a solution to be used in the developing method, and an electronic device formed by using the developing method are provided. The developing method for immersion lithography is a method of developing for immersion lithography of an electronic device with a resist containing a surface segregation agent and chemically-amplified resist, including the step of development with alkali immersion, characterized by the dissolving and removing step, conducted using a dissolving and removing solution that selectively dissolves and removes the surface segregation agent of the resist.

Claims (20)

1. A developing method for immersion lithography of an electronic device with a resist containing a surface segregation agent, which is expressed by a general expression (1), and chemically-amplified resist component, comprising:

a step of development with alkali immersion, wherein the surface segregation agent is insoluble in the developer, and

a step of dissolving and removing, conducted using a dissolving and removing solution that selectively dissolves and removes said surface segregation agent of an upper layer portion of said resist without dissolving said chemically-amplified resist component, said general expression (1) being:

—(CH 2 —C(COOY 0 R f )R)—,

where R represents a hydrogen atom, lower alkyl group, halogen atom, or lower alkyl halide group, Y 0 represents an alkylene group, and R f represents a fluorinated alkyl group,

wherein said dissolving and removing solution comprises a mixture of at least one alcohol and at least one ether.

2. The developing method for immersion lithography according to claim 1 , wherein

said step of dissolving and removing is performed before said step of development, and conducted through rinsing or immersion.

3. The developing method for immersion lithography according to claim 1 , wherein

said step of dissolving and removing is performed simultaneously with said step of development.

4. The developing method for immersion lithography according to claim 1 , wherein

said step of dissolving and removing is performed after said step of development.

5. The developing method for immersion lithography according to claim 1 , wherein

said step of development and said step of dissolving and removing are performed using a same cup.

6. The developing method for immersion lithography according to claim 1 , wherein

said at least one alcohol has a carbon number of 4 or larger and said at least one ether is an alkyl ether having a carbon number of 5 or larger.

7. The developing method for immersion lithography according to claim 1 , wherein

said dissolving and removing solution at said step of dissolving and removing contains a fluorine-containing solvent.

8. The developing method for immersion lithography according to claim 1 , wherein

said dissolving and removing solution at said step of dissolving and removing contains water.

Assignments (1)
CHANGE OF ADDRESS Recorded Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →