IP Library Patent Application 12491548
Patent Application
App. No. 12/491,548

Epoxy Resin, Method for Producing Same and Epoxy Resin Composition Thereof

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Patent No.
US None
App. No.
12/491,548
Abstract

An epoxy resin represented by general formula (I), which satisfies numerical formula (1) mentioned below and comprises hydrolytic halogen of 0.05 wt. % or less, said epoxy resin being produced by the procedure as follows: after dissolving 0.8 to 1.3 mole of epihalohydrin to 1 mole of divalent phenol in a solvent, a pre-reaction is performed over 30 to 70 minutes by adding dropwise 0.25-0.35 mole of 30˜50% aqueous solution of alkali metal hydroxide over 30 to 70 minutes thereto, and thereafter, 0.65-0.75 mole of the remaining 30˜50% aqueous solution of alkali metal hydroxide is added dropwise over about 1 hour to complete the reaction over 1 to 3 hours. wherein n is an integer of 0 or more; A 1 and A 2 are residue of divalent phenol, and can be same or different; both R 1 and R 2 are H or wherein, X: epoxy equivalent (g/eq); Y: phenolic hydroxyl group equivalent (g/eq).

Claims (10)

1 . An epoxy resin represented by general formula (I), which satisfies numerical formula (1) below and comprises hydrolytic halogen of 0.05 wt. % or less, said epoxy resin being produced by the procedure as follows: after dissolving 0.8 to 1.3 mole of epihalohydrin to 1 mole of divalent phenol in a solvent, a pre-reaction is performed over 30 to 70 minutes by adding dropwise 0.25-0.35 mole of 30˜50% aqueous solution of alkali metal hydroxide over 30 to 70 minutes thereto, and thereafter, 0.65-0.75 mole of the remaining 30˜50% aqueous solution of alkali metal hydroxide is added dropwise over approximately 1 hour to complete the reaction over approximately 1 to 3 hours.

wherein n is an integer of 0 or more;

A 1 and A 2 are residue of divalent phenol, and can be same or different;

both R 1 and R 2 are H or

wherein,

X: epoxy equivalent (g/eq);

Y: phenolic hydroxyl group equivalent (g/eq).

2 . The epoxy resin of claim 1 wherein the divalent phenol is bisphenol.

3 . The epoxy resin of claim 1 wherein the epoxy equivalent of the resin is 3000 g/eq or less and the phenolic hydroxyl group equivalent of the resin is 5000 g/eq or less.

4 . An epoxy resin composition containing an epoxy resin according to claim 1 as an essential component.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 23, 2009
From: HANAFUSA, MASAYOSHI; SHINOHARA, SHUYA
To: KUKDO CHEMICAL CO., LTD
Reel/Frame 022996/0455 →