IP Library Granted Patent US 8,169,523
Granted Patent B2
US 8,169,523 · App. 12/491,740 · Granted May 1, 2012

Solid-state imaging device and electronic apparatus

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,169,523
App. No.
12/491,740
Granted
May 1, 2012
Kind
B2
Abstract

A solid-state imaging device includes: a photoelectric conversion portion; a floating diffusion region; a transfer gate electrode made of an n-type semiconductor; a sidewall made of an n-type semiconductor formed on the photoelectric conversion portion side of the transfer gate electrode through an insulating film; and a sidewall made of an insulating layer formed on the floating diffusion region side of the transfer gate electrode.

Claims (20)

1. A solid-state imaging device comprising:

a photoelectric conversion portion;

a floating diffusion region;

a transfer gate electrode made of an n-type semiconductor;

a sidewall made of an n-type semiconductor formed on the photoelectric conversion portion side of the transfer gate electrode through an insulating film; and

a sidewall made of an insulating layer formed on the floating diffusion region side of the transfer gate electrode.

2. The solid-state imaging device according to claim 1 ,

wherein a surface of the photoelectric conversion portion under the sidewall made of the n-type semiconductor is in a pinning mode by charges which are opposite to signal charges by a gate voltage at the time of accumulating charges.

3. An electronic apparatus comprising:

a solid-state imaging device;

an optical system which guides incident light to photoelectric conversion portions of the solid-state imaging device; and

a signal processing circuit which processes output signals of the solid-state imaging device, and

wherein the solid-state imaging device includes

a photoelectric conversion portion,

a floating diffusion region,

a transfer gate electrode made of an n-type semiconductor,

a sidewall made of an n-type semiconductor formed on the photoelectric conversion portion side of the transfer gate electrode through an insulating film, and

a sidewall made of an insulating layer formed on the floating diffusion region side of the transfer gate electrode.

4. The electronic apparatus according to claim 3 ,

wherein, in the solid-state imaging device, a surface of the photoelectric conversion portion under the sidewall made of the n-type semiconductor is in a pinning mode by charges which are opposite to signal charges by a gate voltage at the time of accumulating charges.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 19, 2016
From: SONY CORPORATION
To: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
Reel/Frame 040419/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE FIRST ASSIGNORS NAME ON A DOCUMENT PREVIOUSLY RECORDED ON REEL 022876 FRAME 0400. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT OF ASSIGNORS INTEREST. Recorded Jul 9, 2009
From: ITONAGA, KAZUICHIRO
To: SONY CORPORATION
Reel/Frame 022935/0537 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 25, 2009
From: ITONAGA, KAZUICHRIO
To: SONY CORPORATION
Reel/Frame 022876/0400 →