Printed circuit board assembly
View Patent ↗An assembly comprising a first printed circuit board, PCB, with a ball grid array, BGA, on its underside, a second PCB facing the first PCB and having at least one through-hole between its top and bottom surfaces, its top surface printed with a circuit pattern bonded to the BGA, a heat sink layer facing the bottom surface of the second PCB and having at least one thermally-conductive pin projecting normally into the through-hole or a respective one of the through-holes in the second PCB, and, for each pin, a thermally-conductive stud of the same cross-section as the pin, bonded to the BGA and disposed within the through-hole between the pin and the first PCB in thermal contact with the pin.
1. An assembly comprising:
a first printed circuit board, having a ball grid array, on an underside of the first printed circuit board;
a second printed circuit board having a top surface and a bottom surface, the top surface facing the underside of the first printed circuit board and having at least one through-hole between its top and bottom surfaces, its top surface printed with a circuit pattern bonded to the ball grid array;
a heat sink facing the bottom surface of the second printed circuit board and having at least one thermally-conductive pin projecting normally into the at least one through-hole, respectively, in the second printed circuit board; and
for each thermally-conductive pin, a thermally-conductive stud formed from a solderable material of substantially the same cross-section as the thermally-conductive pin, bonded to the ball grid array and disposed within the through-hole between the thermally-conductive pin and the first printed circuit board in thermal contact with the thermally-conductive pin.
2. An assembly according to claim 1 , in which the thermally-conductive stud and the thermally-conductive pin are circular in cross-section.
3. An assembly according to claim 1 , in which the thermally-conductive stud has a concave surface mating with a convex surface of the thermally-conductive pin.
4. An assembly according to claim 1 , in which the surfaces of the thermally-conductive stud and of the thermally-conductive pin are part-conical with a substantially same semi-angle.
5. An assembly according to claim 1 , in which the stud comprises a material selected from a group consisting of brass, aluminium and copper.
6. An assembly according to claim 1 , in which the stud has a thermal expansion coefficient substantially the same as a thermal expansion coefficient of the second printed circuit board.
7. An assembly according to claim 1 , comprising a thermal grease at an interface between the thermally-conductive pin and the thermally-conductive stud.
8. A method of making an assembly, wherein the method comprises the steps of:
positioning a thermally-conductive stud in a respective throughhole such that a top surface of the thermally-conductive stud is flush with a top surface of a second printed circuit board, the thermally-conductive stud made from a solderable material;
depositing a solder mask layer over the top surface of the second printed circuit board and the thermally-conductive stud;
placing together the second printed circuit board and a heat sink, with a thermally-conductive pin in a through-hole; and
bonding a first printed circuit board to the second printed circuit board and the thermally-conductive stud using a ball grid array.
9. The method according to claim 8 , further comprising the step of:
applying thermal grease to the thermally-conductive stud in the respective through-hole prior to the placing together of the second printed circuit board and the heat sink, to provide a thermally conductive interface between the thermally-conductive stud and the respective thermally-conductive pin.
10. A method according to claim 8 , further comprising the step of adhering the thermally-conductive stud to a wall of the respective through-hole.