BACK-ILLUMINATED IMAGE SENSOR WITH ELECTRICALLY BIASED CONDUCTIVE MATERIAL AND BACKSIDE WELL
Back-illuminated image sensors include one or more contact implant regions disposed adjacent to a backside of a sensor layer. An electrically conductive material, including, but not limited to, a conductive lightshield, is disposed over the backside of the sensor layer. A backside well is formed in the sensor layer adjacent to the backside, and an insulating layer is disposed over the surface of the backside. Contacts formed in the insulating layer electrically connect the electrically conducting material to respective contact implant regions. At least a portion of the contact implant regions are arranged in a shape that corresponds to one or more pixel edges.
1 . A back-illuminated image sensor including a plurality of pixels, the image sensor comprising:
a sensor layer of a first conductivity type having a frontside and a backside opposite the frontside;
an insulating layer disposed over the backside;
one or more contacts disposed in the insulating layer;
a backside well of a second conductivity type formed in the sensor layer adjacent to the backside;
one or more contact implant regions of the second conductivity type formed in the backside well and sensor layer and contacting respective contacts disposed in the insulating layer, wherein each contact implant region has a higher dopant concentration than a dopant concentration of the backside well and each contact implant region electrically connects a respective contact to the backside well; and
an electrically conducting material overlying the insulating layer and having in a shape, wherein each contact electrically connects the electrically conducting material to a respective contact implant region, and wherein at least a portion of the contact implant regions are arranged in a shape corresponding to one or more pixel edges.
2 . The back-illuminated image sensor as in claim 1 , wherein the first conductivity type is a p conductivity type and the second conductivity type is an n conductivity type.
3 . The back-illuminated image sensor as in claim 1 , wherein the one or more contact implant regions of second conductivity type comprise chained isolation implant regions.
4 . The back-illuminated image sensor as in claim 1 , wherein the electrically conducting material is one of an opaque material and a transparent material.
5 . The back-illuminated image sensor as in claim 1 , further comprising a voltage terminal connected to the electrically conducting material.
6 . (canceled)
7 . An image capture device, comprising:
an image sensor comprising:
a sensor layer of a first conductivity type having a frontside and a backside opposite the frontside;
an insulating layer disposed over the backside;
one or more contacts disposed in the insulating layer;
a backside well of a second conductivity type formed in the sensor layer adjacent to the backside;
one or more contact implant regions of the second conductivity type formed in the backside well and sensor layer and contacting respective contacts disposed in the insulating layer, wherein each contact implant region has a higher dopant concentration than a dopant concentration of the backside well and each contact implant region electrically connects a respective contact to the backside well; and
an electrically conducting material overlying the insulating layer and formed in a shape, wherein each contact electrically connects the electrically conducting material to a respective contact implant region, and wherein at least a portion of the contact implant regions are arranged in a shape corresponding to one or more pixel edges.
8 . A back-illuminated image sensor including a plurality of pixels, the back-illuminated image sensor comprising:
a sensor layer of a first conductivity type having a frontside and a backside opposite the frontside;
an insulating layer disposed over the backside;
a plurality of contacts disposed in the insulating layer, wherein a contact is positioned at an edge between two neighboring pixels;
a backside well of a second conductivity type formed in the sensor layer adjacent to the backside;
one or more contact implant regions of the second conductivity type formed in the backside well and sensor layer and contacting respective contacts disposed in the insulating layer, wherein each contact implant region has a higher dopant concentration than a dopant concentration of the backside well and each contact implant region electrically connects respective contacts to the backside well; and
an electrically conducting material overlying the insulating layer and having a shape, wherein each contact electrically connects the electrically conducting material to a respective contact implant region, and wherein at least a portion of the contact implant regions are arranged in a shape that corresponds to one or more pixel edges.
9 . The back-illuminated image sensor as in claim 8 , wherein the first conductivity type is a p conductivity type and the second conductivity type is an n conductivity type.
10 . The back-illuminated image sensor as in claim 8 , wherein the one or more contact implant regions of second conductivity type comprise chained isolation implant regions.
11 . The back-illuminated image sensor as in claim 8 , wherein the electrically conducting material is one of an opaque material and a transparent material.
12 . The back-illuminated image sensor as in claim 8 , further comprising a voltage terminal connected to the electrically conducting material.
13 . (canceled)